Circular diamond double-edged band saw and manufacturing method thereof

Abstract

The invention discloses a ring-shaped diamond double-blade band saw and a manufacturing method thereof. By electroplating the electrodeposited metal layers covering the edges on both sides of a stainless steel strip, diamond particles are uniformly consolidated on the electroplated layers, and the electrodeposited metal layers and The diamond composite coating composed of diamond particles is used for chip processing. The specifications of the band saw of the present invention can be made into different widths, different lengths, and diamond particles of different particle sizes according to requirements. Both edges of the stainless steel belt have a diamond composite coating, which prolongs the service life of the diamond tool and improves the utilization rate. For the processing of hard and brittle materials, the band saw can not only cut thin slices, but also process a certain round surface according to the width of the band saw. , At the same time, it has the ability of trimming and grinding, and its application prospect is very broad.

Description

(1) Technical field: [0001] The invention relates to a diamond cutting tool, in particular to an annular diamond double-edged band saw and a manufacturing method thereof. (two) background technology: [0002] At present, the existing tools for cutting hard and brittle materials (such as: sapphire, monocrystalline silicon rods, gallium arsenide crystals, gemstones, etc.) are mainly internal circular cutting machines and external circular cutting machines using diamond saw blades, etc. , its common feature is that the blades used for cutting are all single-sided blades. When the blade fails, the tool will fail, which greatly reduces the service life of the tool and the utilization rate of the substrate; at the same time, due to size restrictions, it is difficult to use this diamond saw blade to cut and make sheets. , the power is low; when the saw blade is thicker, the incision is larger when cutting precious materials, the material loss is large, and the efficiency is low. ...

AI Technical Summary

Problems solved by technology

[0004] During the wire saw cutting process, the abrasive and the wire saw are separated, so the cutting effect is low. At the same time, the abrasive particles move during the cutting process, and the cuts cut on the workpiece are also relatively large. Generally, the cut is about 1mm. The thickness of each part of the sheet is quite different, the warpage is serious, and the traces left on the surface of the sheet are deep. In order to make the sheet meet the use requirements, it is necessary to perform subsequent grinding and other processing, which increases the processing cost. And the production cycle, and it is easy to cause poor quality of the sliced ​​materials; in addition, due to the small diameter of the wire saw, the service life of the steel wire is short, and frequent wire breakages cannot guarantee the cutting quality and stability

[0005] The above problems are due to the limited length of the diamond tool blade and the insufficient strength of the substrate, which cause the failure of the diamond tool, and it is difficult to ensure efficient and stable cutting.

It is extremely inconvenient to use the above-mentioned diamond tools to cut materials, whether it is continuously sprinkling abrasives on the wire saw or changing the cutter repeatedly during operation, and at the same time, the quality of the cutting surface cannot be guaranteed, and the oil-soaked abrasives have a large pollution to the environment

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