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Resin composition, film, and substrate containing same

A technology of resin composition and base material, applied in the direction of synthetic resin layered products, transportation and packaging, electrical components, etc., can solve the problems of signal delay, loss, signal transmission speed and quality that cannot be ignored, and achieve the improvement of glass transition temperature , The effect of reducing the dielectric constant and dielectric loss factor

Active Publication Date: 2016-06-08
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy resin is widely used as substrate material at present. Due to its high dielectric constant and dielectric loss factor, the signal is delayed or lost during high-frequency transmission, especially for future high-frequency and high-speed information communication products. The speed and quality of signal transmission cannot be ignored
As far as the current technology is concerned, although the dielectric constant and low dielectric loss factor can be reduced by modifying epoxy resin, it has not yet reached the level of high-frequency communication equipment for low dielectric constant and low dielectric loss factor.

Method used

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  • Resin composition, film, and substrate containing same
  • Resin composition, film, and substrate containing same
  • Resin composition, film, and substrate containing same

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0042] Take monovalent copper bromide (3.42g, 24mmol) into a 1000ml double-necked flask, add dibutylamine (314ml, 1690mmol), 1,3,5 trihydroxybenzene (6g, 47.5mmol) and toluene (500mL) as a solvent, heated to 50°C under an oxygen system (flow rate: 3L / min), and stirred for 20 minutes. Then, the monomers 2,6-bismethylphenol (58.1 g, 470 mmol), 2-allyl-6-methylphenol (22 g, 96 mmol) and a little hydrochloric acid were added and precipitated in a large amount of methanol. The obtained precipitated polymer was collected by gravity filtration, dried and sealed at 50° C. to obtain polyphenol ether compound 1 with a yield of 52%. The dielectric constant (Dk) of the polyphenol ether compound 1 = 3.05; the dielectric loss factor (Df) = 0.004; the glass transition temperature (Tg) = 196°C. The above reaction can be expressed as the following formula:

[0043]

[0044] Polyphenol ether compound 1 (where Y can be the same or different groups. Y has i repeating units And j repeating units ...

preparation example 2

[0048] Put epichlorohydrin (10 g, 100 mmol) into a 100 ml double-necked flask, and add the above-mentioned polyphenol ether compound 1 (1 g, 0.154 mmol) for terminal group modification. The reaction was heated to 60°C under a nitrogen system. Then, 2-methoxyethanol (1 g, 13 mmol) was added, and then the solvent was removed by vacuum distillation, dissolved in tetrahydrofuran (THF), and precipitated in methanol. The obtained polymer was collected by gravity filtration, dried and sealed at 50°C to obtain polyphenol ether compound 2; the dielectric constant (Dk) of polyphenol ether compound 2 was 2.91; the dielectric loss factor (Df) was 0.005; Glass transition temperature (Tg) = 190°C. The above reaction can be expressed as the following formula:

[0049] (Among them, Y can be the same or different groups. Y has i repeating units And j repeating units Where i is a positive integer, j is a positive integer, and the sum of i and j is 6 to 300. In addition, the repeating unit a...

preparation example 3

[0053] Take 1 g of the above polyphenol ether compound 1 (0.154 mmol) into a 100 ml double-necked flask, add 10 mL of tetrahydrofuran (THF) solvent, and heat to 60° C. under a nitrogen system. Next, 0.2 g of 50% sodium hydroxide aqueous solution was added, followed by slowly adding p-chloromethyl styrene (0.8 mL, 1.1 mmol). The solution after the reaction was washed with deionized water to remove impurities and salts, and then dissolved in tetrahydrofuran and precipitated in methanol. The precipitated polymer was collected by gravity filtration, and dried and sealed at 50°C to obtain polyphenol Ether compound 3. The above reaction can be expressed as the following formula:

[0054]

[0055] (Among them, Y can be the same or different groups. Y has i repeating units And j repeating units Where i is a positive integer, j is a positive integer, and the sum of i and j is 6 to 300. In addition, the repeating unit as well as It is repeated in random or block fashion. Y is a repe...

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Abstract

A disclosure provides a resin composition, a prepreg, and a substrate employing the same. According to an embodiment of the disclosure, the resin composition includes a polyphenylene ether compound, and a bismaleimide. The prepreg includes a cured product of the resin composition. The substrate includes a product fabricated by the resin composition or the prepreg.

Description

Technical field [0001] The present invention relates to a resin composition, and particularly relates to a resin composition for electronic components. Background technique [0002] In the new century, electronic products tend to be light, thin, short, and small, and transmit at high frequencies, so that the wiring of printed circuit boards must be high-density to increase the transmission speed while maintaining signal integrity. Electronic products use multi-layered semiconductor components and sophisticated packaging technology, through advanced bonding and mounting technology to achieve high-density multi-layer circuit boards. [0003] In the field of electronic components, there is an urgent demand for high-frequency communication equipment. Therefore, related electronic component materials, such as semiconductor sealing materials with low dielectric constant and materials with low dielectric loss factors, have recently been needed. It can transmit data quickly, and will not ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/12C08L47/00C08L79/08C08K3/36C08G65/48B32B27/04B32B15/08
CPCH05K1/0366B29B7/90B29K2069/00H05K1/0326H05K2201/0209Y10T428/31681Y10T428/31725
Inventor 杨伟达梁丽君林宜弘林忠诚
Owner IND TECH RES INST
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