Novel waterproof SMD (surface mounted device) LED and production technology thereof

Abstract

The invention discloses a novel waterproof SMD (surface mounted device) LED and a production technology thereof, and relates to the technical field of LED package. The novel waterproof SMD LED comprises an epoxy resin package main body and at least two brackets of which one ends are extended into the interior of the epoxy resin package main body, wherein a solid crystal region is arranged on one bracket, LED wafers are fixed in the a solid crystal region, the top surface of the epoxy resin package main body is composed of peripheral top planes and a light-emitting surface in the middle, and the light-emitting surface is a spherical shape, thereby forming the spherical lens. The novel waterproof SMD LED has the beneficial effects that: during the production of the novel waterproof SMD LED, the wire-welded bracket is subjected to extrusion molding package by using a high-pressure glue injector, the epoxy resin is tightly combined with the brackets by using the heavy pressure produced in extrusion molding, and one ends of the brackets and the LED wafers are integrally covered by the epoxy resin package main body, so that the integral package of the epoxy resin is realized, thereby achieving the waterproof and moisture-proof function.

Description

【Technical field】 [0001] The present invention relates to LED encapsulation technology, more specifically, the present invention relates to a novel waterproof patch LED and a production process for making the novel waterproof patch LED. 【Background technique】 [0002] In recent years, SMD LED has become a development hotspot, which solves problems such as brightness, viewing angle, flatness, and consistency. It is very suitable for high-resolution outdoor, outdoor full-color display screens, and outdoor building applications. However, with the increasing popularity of LEDs, the performance requirements are getting higher and higher. Ordinary SMD LEDs have low waterproof performance and cannot be used in humid and harsh environments for a long time. [0003] The difficulty of patch LED waterproofing is mainly caused by two aspects: one is the water seepage of the LED bracket. The water seepage of the LED bracket is caused by the material of the bracket and the contact surfac...

AI Technical Summary

Problems solved by technology

Weaknesses of the bracket with this material structure in terms of waterproofing are: 1. The PPA material is easy to absorb moisture, and the moisture absorption rate is about 6%; After and after the use of the LED, it becomes larger, so that impurities such as water vapor invade

[0004] The second is the water seepage of the LED packaging adhesive layer

The thermal expansion coefficient of epoxy resin and silicone resin is different from that of the LED bracket. During use, thermal expansion and contraction will weaken the adhesion between the encapsulation gel and the LED bracket, and gaps will appear, causing moisture intrusion.

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