Device and method for analyzing failures of TSV (through silicon via) wafer level packaged MEMS (micro-electro-mechanical systems) chips

Abstract

The invention discloses a device and a method for analyzing failures of TSV (through silicon via) wafer level packaged MEMS (micro-electro-mechanical systems) chips. The device comprises a microscope, a reflective box and a probe system. The reflective box comprises a shell, two reflective mirrors and transparent glass, a 90-degree angle is formed by the two reflective mirrors in the shell, the transparent glass is arranged at a top opening of the shell, and 45-degree included angles are formed between the reflective mirrors and the bottom of the shell; the probe system comprises probes, probe arms and a probe seat, the probes are connected with the probe seat by the probe arms, and conducting wires are connected onto the probes and are connected with testing devices or power sources. The method includes placing a to-be-analyzed MEMS chip on the transparent glass and pricking the probes on a pressure welding block; inputting excitation voltages into an MEMS structure via the conducting wires; observing response of the MEMS structure via the microscope and judging failure mechanisms of an MEMS device. The device and the method have the advantages that the directions of light rays can be changed by the aid of the reflective mirrors, the failure mechanisms of the MEMS chip can be analyzed without back lenses, the device is simple in structure, and good effects can be realized by the device; the method is simple in operation, and the failures of the to-be-analyzed MEMS chip can be quickly and accurately analyzed by the aid of the method.

Description

Technical field [0001] The invention belongs to the field of MEMS chip analysis, and specifically relates to a failure analysis device for TSV wafer-level packaging MEMS chips. The invention also relates to a method for performing failure analysis of MEMS chips by using this analysis device. Background technique [0002] MEMS (Micro-Electro-Mechanical Systems) is the abbreviation of Micro-Electro-Mechanical Systems. MEMS manufacturing technology uses micro-machining technology, especially semiconductor wafer manufacturing technology, to create various micro-mechanical structures, combined with application-specific control integrated circuits (ASIC), to form Intelligent micro sensors, micro actuators and other MEMS components. MEMS components have the advantages of small size, low cost, high reliability, strong resistance to harsh environments, low power consumption, high intelligence, easy calibration, and easy integration. They are widely used in consumer electronic products (su...

AI Technical Summary

Problems solved by technology

The bonding pad 29 of the MEMS chip of this TSV wafer level package is positioned at the top of the cover plate 26. After the cover plate 26 is removed, the bonding pad 29 and the MEMS structure 21a are distributed on the upper and lower sides of the cover plate 26. Like this, in failure analysis When the cover plate is removed, the response of the MEMS structure 21a cannot be directly observed through a microscope. Therefore, for MEMS chips in TSV wafer-level packaging, how to perform failure analysis has become a difficult problem at present.

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