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Manufacturing method of resin for high-frequency copper clad plates

A resin for copper-clad laminates and a technology for its production method, which is applied in the field of resin production for high-frequency copper-clad laminates, can solve the problems of high-frequency data transmission, constant and large dielectric loss, etc., and achieve reduced equipment investment and good processability Effect

Inactive Publication Date: 2014-10-01
铜陵浩荣华科复合基板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that ordinary epoxy resin-based copper-clad laminates have large dielectric constant and dielectric loss, and cannot meet high-frequency data transmission at all.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A method for making resin for high-frequency copper-clad laminates, the steps are as follows:

[0017] a. Add 300 parts of toluene and 5 parts of benzoyl peroxide into the reactor and stir to dissolve;

[0018] b. Add 100 parts of polyphenylene ether and 10 parts of allyl bisphenol A, and raise the temperature of the reactor to 90°C, and react for 60 minutes;

[0019] c. Add 8 parts of dicumyl peroxide and 50 parts of triallyl cyanate, keep the temperature at 90°C, and continue the reaction for 90 minutes;

[0020] d. Immediately after the completion of the reaction time, turn on the cooling device to cool down to below 50°C.

Embodiment 2

[0022] A method for making resin for high-frequency copper-clad laminates, the steps are as follows:

[0023] a. Add 500 parts of toluene and 10 parts of benzoyl peroxide into the reaction kettle and stir to dissolve;

[0024] b. Add 100 parts of polyphenylene ether and 15 parts of allyl bisphenol A, and raise the temperature of the reactor to 90°C, and react for 60 minutes;

[0025] c. Add 12 parts of dicumyl peroxide and 70 parts of triallyl cyanate, keep the temperature at 90°C, and continue the reaction for 90 minutes;

[0026] d. Immediately after the completion of the reaction time, turn on the cooling device to cool down to below 50°C.

Embodiment 3

[0028] A method for making resin for high-frequency copper-clad laminates, the steps are as follows:

[0029] a. Add 450 parts of toluene and 8 parts of benzoyl peroxide into the reaction kettle and stir to dissolve;

[0030] b. Add 100 parts of polyphenylene ether and 12 parts of allyl bisphenol A, and raise the temperature of the reactor to 90°C, and react for 60 minutes;

[0031] c. Add 10 parts of dicumyl peroxide and 65 parts of triallyl cyanate, keep the temperature at 90°C, and continue the reaction for 90 minutes;

[0032] d. Immediately after the reaction time is completed, turn on the cooling device to cool down to below 50°C

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PUM

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Abstract

The invention discloses a manufacturing method of a resin for high-frequency copper clad plates, which comprises the following steps: adding toluene and benzoperoxide into a reaction kettle, and dissolving by stirring; adding polyphenylether and allyl bisphenol A, heating the reaction kettle to 90 DEG C, and reacting for 60 minutes; adding dicumyl peroxide and triallyl cyanate, and continuing reaction for 90 minutes while keeping the temperature at 90 DEG C; and after the reaction time finishes, immediately starting a cooler to cool to 50 DEG C below. The prepared resin effectively lowers the dielectric constant and dielectric loss of the copper clad plate, wherein the dielectric constant is lowered from 4.8 to 3.4, and the dielectric loss is lowered from 0.02 to 0.01 below. The resin is suitable for requirements of high-frequency electronic materials. The manufacturing technique is suitable for the existing copper clad plate production technique, and reduces the equipment investment. The copper clad plate has better processibility than other high-frequency plates.

Description

technical field [0001] The invention relates to a manufacturing method of resin for high-frequency copper-clad laminates. Background technique [0002] With the high-frequency development of electronic equipment, especially in the field of communication, the copper clad laminate must have a lower dielectric constant to meet the high-frequency requirements. General epoxy resin-based copper clad laminates can no longer meet higher requirements. At present, the development of high-frequency copper-clad laminates is being carried out at home and abroad. The resin materials that can be used for the manufacture of high-frequency copper-clad laminates mainly include polytetrafluoroethylene resin, cyanate resin, polyphenylene ether resin and special epoxy resin. [0003] Due to the large dielectric constant and dielectric loss of ordinary epoxy resin-based copper-clad laminates, they cannot meet the requirements of high-frequency data transmission at all, and will cause overheating...

Claims

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Application Information

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IPC IPC(8): C08F283/08
Inventor 田磊
Owner 铜陵浩荣华科复合基板有限公司
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