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Metal product surface protection method

A technology for metal surfaces and metal products, which is applied in the direction of metal material coating process, coating, gaseous chemical plating, etc., can solve the problems of insufficient density of protective film, uneven thickness, affecting appearance, etc., and achieve long service life and durability Good abrasiveness, high uniformity and thickness effect

Active Publication Date: 2014-09-24
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above defects or improvement needs of the prior art, the present invention provides a method for protecting the surface of metal products, the purpose of which is to deposit a dense nano-scale ceramic film on the surface of metal products using atomic layer deposition technology, thus solving the current problems The protective film on the surface of the metal product is not dense enough, the thickness is uneven, and the life is short and it is easy to affect the appearance after a long time, so that the surface of the metal product can be completely separated from water and oxygen to achieve long-term effective protection

Method used

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  • Metal product surface protection method

Examples

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Embodiment 1

[0069] Present embodiment is about 100cm to a piece of surface area 2 , and the surface of copper handicrafts with patina spots formed in the natural environment is subjected to atomic layer deposition, and coated with a layer of 5nm thick Al 2 o 3 film as an example, in which trimethylaluminum TMA and water H 2 O is the precursor, its The main reaction equation is:

[0070] (A)AlOH * +Al(CH 3 ) 3 →AlOAl(CH 3 ) 2 * +CH 4

[0071] (B)AlCH 3 * +H 2 O→AlOH * +CH 4

[0072] After the pre-treatment of the surface, place it in the reaction chamber of the atomic layer deposition equipment, the temperature of the chamber is 90°C, the vacuum pumping rate is adjusted to 100Pa / s by adjusting the flow rate of the vacuum pump, and the carrier gas flow rate is selected to be 500sccm to remove Part of the reagent used to clean the surface remains on it for about 1 hour, and the deposition reaction starts. After the pressure in the chamber is evacuated to 2O pulse for 10s, ...

Embodiment 2

[0074] Present embodiment is about 6cm to a piece of surface area 2 Atomic layer deposition was performed on the surface of silver coins, and a layer of 5nm thick TiO was coated 2 Thin film as an example, choose Ti[OCH(CH 3 )] 4 with H 2 O is the precursor, its The main reaction equation is:

[0075] Ti[OCH(CH 3 )] 4 +2H 2 O→TiO 2 +4(CH 3 ) 2 CHOH

[0076] After the pre-treatment of the surface, place it in the reaction chamber of the atomic layer deposition equipment, the temperature of the chamber is 90°C, and use the maximum vacuum rate and 100 sccm of carrier gas to remove the residue of some reagents used to clean the surface on it. After about 0.5 hour, the deposition reaction started. After the pressure in the cavity is reduced to 3 )] 4 Pulse for 5s, wait for 30s, turn on the vacuum pump and remove the precursor Ti[OCH(CH 3 )] 4 About 30s, turn off the pump and feed the precursor H 2 O pulse for 5s, wait for 30s, turn on the vacuum pump and remove the ...

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Abstract

The invention discloses a metal product surface protection method which comprises the following steps: pretreatment: carrying out clearing, degreasing, cleaning and restoration on the metal product surface to be protected; treatment before deposition: putting the pretreated metal product in an atomic layer deposition device, purging the surface with carrier gas, and meanwhile, evacuating the atomic layer deposition device by using a vacuum pump; deposition: alternately introducing multiple precursors at proper reaction temperature under proper pressure to respectively adsorb the precursors to the surface to be protected, and initiating chemical reaction among the precursors to form a single-layer film; and repeating the deposition step to generate a compact film on the surface to be protected, thereby implementing water-barrier oxygen-barrier protection on the metal product surface. The method can solve the problems of insufficient compactness, nonuniform thickness, short service life, high tendency to generating gloss and the like in the existing protective film on the metal product surface.

Description

technical field [0001] The invention belongs to the field of cultural relics protection, and more specifically relates to a surface protection method for copper, silver and other metal handicrafts or cultural relics. Background technique [0002] Copper, silver and other metal crafts or cultural relics are in contact with water and oxygen in the air, and the surface undergoes a slow chemical reaction, which makes it gradually corroded, oxidized, and peeled off, and the surface loses its original color and smoothness, which greatly damages them. the value of. Therefore, it is of great significance to protect the surface of copper, silver and other metal crafts and cultural relics from water and oxygen. [0003] The traditional surface protection method is mainly to cover the surface with a film of organic materials such as nitrocellulose, ethyl acrylate or microcrystalline wax to achieve the purpose of water and oxygen isolation. However, existing methods often have some di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/455
Inventor 陈蓉段晨龙褚波单斌文艳伟
Owner HUAZHONG UNIV OF SCI & TECH
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