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Packaging structure and packaging method

A technology of packaging structure and packaging method, which is applied to laser welding equipment, electrical components, circuits, etc., can solve the problems that the performance of packaging structure needs to be improved, the difficulty of chip design, etc., so as to reduce the difficulty of packaging process, reduce the difficulty of design, and achieve high flexibility. Effect

Active Publication Date: 2016-09-28
CHINA WAFER LEVEL CSP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the prior art, when the image sensing unit and the signal processing unit are arranged on one chip, the chip design is difficult and the performance of the formed package structure needs to be improved.

Method used

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  • Packaging structure and packaging method
  • Packaging structure and packaging method

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Embodiment Construction

[0044] It can be seen from the background art that the existing chip packaging including the image sensing unit and the signal processing unit is very difficult, and the performance of the formed packaging structure needs to be improved.

[0045] It is found through research that in the prior art, the image sensing unit and the signal processing unit are usually packaged on the same chip. Generally, the chip is obtained after cutting the wafer. Therefore, in the prior art, the image sensing chip and the signal processing chip are manufactured in the same wafer, and the wafer can be called an image sensing wafer. Signal processing chips are fabricated within the image sensor wafer.

[0046] In the prior art, both the image sensor chip and the signal processing chip must be formed in the image sensor wafer, and the arrangement and interconnection between the image sensor chip and the signal processing chip need to be considered, which will lead to chip manufacturing The difficu...

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Abstract

A packaging structure and a packaging method, wherein the packaging structure includes: an image sensor chip, the image sensor chip has a first surface and a second surface opposite to the first surface, and the first surface of the image sensor chip has The photosensitive element and the first pad surrounding the photosensitive element, the image sensor chip has a metal column, and one end of the metal column is electrically connected to the first pad, and the other end opposite to the one end is connected to the first pad of the image sensor chip. Both sides are flush; signal processing chip, the signal processing chip has a third side and a fourth side opposite to the third side, the third side of the signal processing chip has a second pad, and the third side of the signal processing chip It is fixedly bonded to the second surface of the image sensor chip, and the second pad is electrically connected to the metal column; the through hole penetrates through the fourth surface of the signal processing chip, and the through hole exposes the surface of the second pad. The present invention improves the packaging performance by arranging the image sensing chip and the signal processing chip separately.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to a packaging structure and a packaging method. Background technique [0002] An image sensor chip is a chip that senses external light and converts it into electrical signals. After the image sensor chip is manufactured, a series of packaging processes are performed on the image sensor chip to form a packaged image sensor for use in various electronic devices such as digital cameras and digital video cameras. [0003] In the prior art, an image sensing chip is composed of an image sensing (CIS, Contact Image Sensor) unit and a signal processing (DSP, Digital Signal Processor) unit. A signal processing unit, wherein the image sensing unit is used to convert the received optical signal into an electrical signal, and the signal processing unit is used to process the electrical signal converted from the optical signal. [0004] However, in the prior art, when an image sensing un...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L21/60B23K26/21
CPCH01L2224/10
Inventor 王之奇喻琼王蔚
Owner CHINA WAFER LEVEL CSP
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