Coating method of border glue and substrate mother board

Abstract

The invention discloses a frame glue coating method and a substrate mother board, which belong to the field of display technology. The coating method comprises: coating equipment adopts a one-stroke continuous coating method to apply frame glue to a plurality of first substrates; When the equipment moves from one corner of the first substrate to one corner of the adjacent first substrate, the coating line is a broken line. The technical solution of the present invention can set the position of the intersection point of the sealant at the corner of the first substrate, so that Effectively reduces the mura problem caused by the non-uniform thickness of the box. At the same time, the coating method provided by the invention is also suitable for coating the first substrate with special typesetting on the substrate motherboard, so it can effectively reduce the coating on the substrate motherboard. The time it takes for the cloth to seal the frame.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a coating method of a frame glue and a base plate. Background technique [0002] A liquid crystal display is a commonly used flat panel display at present, and a thin film transistor liquid crystal display (Thin Film Transistor Liquid Crystal Display, TFT-LCD for short) is a mainstream product in the liquid crystal display. [0003] TFT-LCD generally includes a first substrate, a second substrate, and a frame glue that bonds the first substrate and the second substrate to seal the liquid crystal between the first substrate and the second substrate. The coating of the frame glue is currently mostly done by dripping (OneDropFilling, referred to as ODF) process for production. Specifically, a substrate mother board is provided, and several first substrates are formed on the substrate mother board, and then coating equipment is used to coat each side of the first substrate. The co...

AI Technical Summary

Problems solved by technology

[0007] (1) After the first substrate and the second substrate are boxed, the box thickness at the intersection point of the sealant is not uniform with the box thickness at other positions, and mura is prone to occur on the TFT-LCD

[0008] (2) The position of the intersection point 4 of the sealant is located in the middle of one side of the first substrate, which is likely to cause poor cutting at this position in the subsequent cutting process;

[0009] (3) For products with special typesetting on the substrate motherboard, it is not convenient to use this cross-type continuous coating for coating

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