Coating device and coating method

Abstract

The invention provides a coating device and a coating method for co-evaporating a treated substrate. The coating device comprises a first evaporation source, a second evaporation source and a first perforated shielding plate, wherein the first evaporation source is arranged below the treated substrate; the second evaporation source is arranged below the treated substrate; the first perforated shielding plate is arranged between the first evaporation source and the treated substrate and comprises a plurality of perforated areas with different perforation density, and the perforated areas with different perforation density can be aligned with the first evaporation source by virtue of rotating. By adopting the coating device and the coating method disclosed by the invention, the proportion of different evaporation materials can be conveniently adjusted in the evaporation process without affecting the coating quality, and the cost is relatively low, so that the coating device and the coating method is suitable for industrial production.

Description

technical field [0001] The invention relates to a film coating device, in particular to a film coating device and a film coating method for co-evaporating a substrate to be processed. Background technique [0002] As we all know, the coating process is widely used in the industry, and is generally used in the metal processing industry, semiconductor industry, and optoelectronic industry. In recent years, due to the rapid development of the semiconductor industry and the optoelectronic industry, the coating technology has made significant progress. There are three forms of vacuum coating, namely evaporation coating, sputtering coating and ion plating. [0003] Evaporation coating is referred to as evaporation, which usually converts the thin film material from solid state to gaseous or ionized state. The gaseous or ionized material travels through the space from the evaporation source and reaches the basic surface. After the material reaches the surface of the substrate, it ...

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Problems solved by technology

[0004] However, when coating two different materials on the same substrate at the same time, it is difficult to adjust the ratio of the two materials "in real time" or even form a film layer with a gradient concentration.

like figure 1 As shown, the film coating device includes a first evaporation source 101 and a second evaporation source 102, which are simultaneously arranged below the substrate 200 to be processed. Different materials are loaded in the first evaporation source 101 and the second evaporation source 102, and at the same time For evaporation, if you want to adjust the ratio of the two evaporation materials during this period, you usually have to lower or increase the temperature of the first evaporation source 101 or the second evaporation source 102, but this heating and cooling process is slow, not only time-consuming It is laborious and will affect the coating quality, so it is not suitable for industrial production applications

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