Three-dimensional integrated circuit multi-physical-domain collaborative design method based on through-silicon via

Abstract

The invention discloses a three-dimensional integrated circuit multi-physical-domain collaborative design method based on the through-silicon via. Influences, caused by coupling among the thermology physical domain, the mechanics physical domain and the electricity physical domain, on reliability of a three-dimensional integrated circuit are taken into consideration, the thermology design step and the mechanics design step are added, and the thermology, mechanics and electricity multi-physical-domain collaborative design method is built. According to the multi-physical-domain collaborative design method, mutual iteration is carried out among the thermology design step, the mechanics design step and the electricity design step till the thermology design step, the mechanics design step and the electricity design step all meet the design requirements, and the design requirement of the three-dimensional integrated circuit for high reliability is ensured. The defect that an existing three-dimensional integrated circuit design process is lacking in the thermology design step and the mechanics design step is overcome.

Description

technical field [0001] The invention belongs to the technical field of three-dimensional integrated circuits, and relates to a multi-physical domain collaborative design method of three-dimensional integrated circuits based on through-silicon vias. Background technique [0002] The three-dimensional integration technology based on Through-Silicon Via (TSV) enables vertical transmission of information between stacked chips through through-silicon vias, which can greatly shorten the length of the global interconnection of the chips and ease the blockage of wiring channels. One of the most effective ways to develop. Although three-dimensional integration technology has great advantages, the introduction of vertical interconnection in electronic systems increases the design complexity of three-dimensional integrated circuits. the biggest obstacle to development. [0003] At present, there are two main problems faced by the three-dimensional integrated circuit design technology...

AI Technical Summary

Problems solved by technology

Since the developed design software is very different and has a certain degree of pertinence, the design process established with it is not the same and does not have universality.

Moreover, the development of dedicated three-dimensional circuit design software will cost a lot of money, which will dramatically increase the cost of three-dimensional integrated circuit design

[0005] Second, the three-dimensional integrated circuit design process based on planar integrated circuit design methodology cannot complete the collaborative design of electrical, mechanical and thermal multi-physics domains

But the disadvantage is that due to the design of planar integrated circuits, the overall design process does not introduce thermal and force design, and does not consider the influence of coupling between thermal, force, and electrical multi-physics domains on the reliability of three-dimensional integrated circuits, and lacks multi-physics field coordination. design, so the three-dimensional integrated circuit designed through this process may not meet the design requirements in terms of thermal and mechanical reliability

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