A kind of circuit board manufacturing process and circuit board

Abstract

An embodiment of the invention discloses a process of manufacturing a circuit board and the circuit board. The process comprises making an inner plate; etching the inner surfaces of single-sided copper substrates, the outer surfaces of which comprises insulating layers; laminating the two etched single-sided copper substrates respectively onto the upper and lower sides of the inner plate to form a laminated board, with the inner surfaces of the etched single-sided copper substrate facing toward the inner plate and the non-etched insulating layers facing outward; drilling holes in the laminated board, conducting copper plating for the holes, and forming shielding layers outside the laminated board; and etching the shielding layers. The circuit board reduces the difference of line width between the surface layer and the inner plate after etching, and the technical problem of low alignment accuracy caused by manual alignment of the shielding layer in the prior art is solved.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, and more specifically, relates to a circuit board manufacturing process and a circuit board. Background technique [0002] The circuit board is the support of electronic components and the provider of electrical connections for electronic components. [0003] The existing circuit board manufacturing process is to perform mechanical lead holes on the inner layer board with the surface layer (copper foil) pressed together, and then perform copper plating on the hole and surface layer etching. In addition, in order to shield electromagnetic interference, after the circuit board is manufactured, the independent shielding film needs to be manually aligned and attached to the circuit board. [0004] The existing circuit board manufacturing process has at least the following defects: the step of further copper plating on the surface layer will cause the thickness of the copper aroun...

AI Technical Summary

Problems solved by technology

[0004] The existing circuit board manufacturing process has at least the following defects: the step of further copper plating on the surface layer will cause the copper thickness around the lead hole to be larger than the copper foil thickness in the inner layer board, resulting in a gap between the surface layer and the inner layer board after the circuit is etched. There will be different line widths, which will lead to the impedance difference between the surface layer and the inner layer board, thereby causing interference to the device impedance and voltage calculation on the PCB, and the manual alignment and pasting of the shielding film will appear Technical issues with poor bit precision

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