Heat-conducting copper foil

A copper foil and heat-resistant technology, applied in the field of metal film, can solve the problems of unstable system operation, high integration, and difficulty in installing traditional radiators, etc., and achieve the effects of improved heat dissipation, high reliability, and low price

Inactive Publication Date: 2014-06-25
TAICANG TAIBANG ELECTRONICS TECH
View PDF5 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Nowadays, the performance of chips is getting higher and higher, followed by the rapid increase of chip heat generation, which makes chip heat dissipation a huge problem. In places with large spaces, chips often use radiators for heat dissipation, and mobile devices are often integrated. High, it is not easy to install a traditional radiator, and only relying on air heat transfer will cause the system to run unstable, and there is a need for a device that can transfer heat well and is easy to use

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat-conducting copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0013] see figure 1 , the embodiment of the present invention includes:

[0014] A heat-conducting copper foil, comprising: a release layer 1, an adhesive 2, a copper foil 3 and an insulating layer 4, one side of the copper foil 3 is bonded with the insulating layer 4, and the other side of the copper foil 3 is coated with an adhesive 2. The other side of the insulating layer 4 is provided with an adhesive 2 , and the release layer 1 is provided on both sides of the adhesive 2 .

[0015] The release layer 1 is made...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a heat-conducting copper foil which comprises de-bonding layers, an adhesive, a copper foil and an insulation layer, wherein the insulation layer is attached to one side of the copper foil; the other side of the copper foil is coated with the adhesive; the adhesive is arranged on the other side of the insulation layer; the de-bonding layers are arranged on two sides of the adhesive. According to the mode, the heat-conducting copper foil has the advantages of high reliability, good heat conductivity, convenience in adhesion, good insulativity, small thickness, easiness in bending, low price and the like, and is suitable for heat dissipation of chips of small electronic products.

Description

technical field [0001] The invention relates to the field of metal films, in particular to a heat-conducting copper foil. Background technique [0002] Copper is a material that has been used for a long time. It has good electrical and thermal conductivity and is widely used in the electronics industry. Nowadays, the performance of chips is getting higher and higher, followed by the rapid increase of chip heat generation, which makes chip heat dissipation a huge problem. In places with large spaces, chips often use radiators for heat dissipation, and mobile devices are often integrated. High, it is difficult to install a traditional heat sink, and only relying on air heat transfer will cause the system to run unstable. There is a need for a device that can transfer heat well and is easy to use. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a heat-conducting copper foil, which can realize rapid conduction of h...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/085B32B27/10B32B7/12
Inventor 曹群
Owner TAICANG TAIBANG ELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap