Ultrasonic transducer

A transducer and ultrasonic technology, applied in the direction of piezoelectric/electrostrictive transducers, sensors, sensor types, etc., can solve the problems of damaged acoustic wave characteristics of the matching layer, unstable acoustic wave characteristics, poor durability, etc., to achieve The effect of stabilizing the acoustic wave characteristics, realizing the acoustic wave characteristics, and increasing the vibration area

Inactive Publication Date: 2014-06-18
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When mounting an ultrasonic transducer with such a configuration on a mounting substrate, the bottom surface of the matching layer is in contact with the mounting substrate, which may destabilize the acoustic characteristics.
In addition, since the entire matching layer is exposed to the outside, durability such as weather resistance and impact resistance is poor, so damage to the matching layer may occur and the acoustic characteristics may deteriorate.

Method used

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  • Ultrasonic transducer
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Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach 》

[0032] Below, based on figure 1 Next, the configurations of the ultrasonic transducer, the vibrator, and the multiple supply detection sensor according to the first embodiment of the present invention will be described.

[0033] figure 1 (A) is a conceptual diagram of the multiple feed detection sensor 101 using the ultrasonic transducers 1A and 1B according to the first embodiment of the present invention.

[0034] The multiple supply detection sensor 101 includes an ultrasonic transducer 1A for wave transmission and an ultrasonic transducer 1B for wave reception. In addition, an oscillator 102 connected to the ultrasonic transducer 1A, an oscilloscope 104 connected to the ultrasonic transducer 1B, and an amplifier 103 connected between the ultrasonic transducer 1B and the oscilloscope 104 are provided. The ultrasonic transducer 1A and the ultrasonic transducer 1B are arranged to face each other on both sides of a paper conveyance path 109 in a printing machine or the lik...

no. 2 Embodiment approach 》

[0058] Figure 5 It is a cross-sectional view of the ultrasonic transducer 21 according to the second embodiment of the present invention. Figure 5 (A) is through Figure 5 (B) Cross-sectional view at the position of the dashed-dotted line BB'. Figure 5 (B) is through Figure 5 A cross-sectional view at the position of the one-dot chain line A-A' shown in (A).

[0059] The ultrasonic transducer 21 of this embodiment includes a vibrator 31 having a different configuration from that of the first embodiment. The vibrator 31 includes a matching layer 31A and a piezoelectric element layer 31B. The matching layer 31A has a square front and back, the vertical and horizontal dimensions of the front are smaller than those of the back, and the sides have a tapered columnar shape. The vertical and horizontal dimensions on the rear surface of the matching layer 31A are equal to the vertical and horizontal dimensions on the front surface of the piezoelectric element layer 31B.

[006...

no. 3 Embodiment approach 》

[0062] Image 6 It is a cross-sectional view of the ultrasonic transducer 41 according to the third embodiment of the present invention. Image 6 (A) is through Image 6 (B) Cross-sectional view at the position of the dashed-dotted line BB'. Image 6 (B) is through Image 6 A cross-sectional view at the position of the one-dot chain line A-A' shown in (A).

[0063] The ultrasonic transducer 41 of the present embodiment includes a vibrator 51 and a resin case 43 having different configurations from those of the first embodiment. The vibrator 51 includes a matching layer 51A and a piezoelectric element layer 51B. The matching layer 51A has a square front and back, and the vertical and horizontal dimensions are the same as those of the piezoelectric element layer 51B, and the outer surface of the matching layer 51A is flush with the outer surface of the piezoelectric element layer 51B. The resin case 43 is formed with an opening portion 43A, a hole 43B, a groove 43C, and a s...

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Abstract

The present invention achieves an ultrasonic transducer that has a structure suitable for use in the high-frequency band and that is highly durable. In addition, the sonic characteristics of the ultrasonic transducer are less likely to be affected by the bonding strength, contact pressure, and / or physical variation between members. The ultrasonic transducer (1A) is provided with a resin case (3) and a transducer (11). The resin case (3) has an opening (3A). The transducer (11) is provided with a matching layer (11A) and a piezoelectric element layer (11B). The piezoelectric element layer (11B) is configured so as to perform stand-alone thickness vibration, and the side surface of the piezoelectric element layer that intersects the main surface of the thickness direction faces and is in contact with the inner wall surface of the opening (3A). The matching layer (11A) is layered in the thickness direction of the piezoelectric element layer (11B), and the side surfaces that protrude from the opening (3A) in the thickness direction of the piezoelectric element layer (11B) and intersect the main surface of the thickness direction are free from the inner wall surface of the opening (3A).

Description

technical field [0001] The present invention relates to an ultrasonic transducer having a structure in which a piezoelectric element layer and a matching layer are laminated. In particular, it relates to an ultrasonic transducer in which a piezoelectric element layer vibrates in thickness in a lamination direction of a piezoelectric element layer and a matching layer. Background technique [0002] The ultrasonic transducer is configured to include a piezoelectric element layer for transmitting or receiving sound waves. In an ultrasonic transducer, in order to reduce the reflection of sound waves at the interface between the piezoelectric element layer and the outside (external air), sometimes a matching layer for achieving acoustic impedance matching is provided between the piezoelectric element layer and the outside ( For example, refer to Patent Document 1.). [0003] Figure 8 (A) is a diagram explaining a configuration example of an ultrasonic transducer according to a...

Claims

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Application Information

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IPC IPC(8): H04R17/00H01L41/083
CPCB06B1/0611H01L41/083H10N30/50
Inventor 西江纯一近藤亲史太田顺司
Owner MURATA MFG CO LTD
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