Mobile phone, signal receiving device and manufacturing method of signal receiving device

Abstract

The invention relates to the technical field of communication, in particular to a mobile phone, a signal receiving device and a manufacturing method of the signal receiving device. The signal receiving device comprises a shrapnel, a PCB (printed circuit board) and an antenna, wherein the PCB is provided with a signal processing element, the surface of the PCB is concavely provided with a shrapnel accommodating part, the shrapnel is arranged in the shrapnel accommodating part and comprises a fixed end and a free end, the fixed end is fixed relative to the PCB, and is communicated with the signal processing element through an electric signal, the free end is elastically abutted against the antenna, and the signal received by the antenna is transmitted to the signal processing element through the shrapnel. The PCB is provided with the shrapnel accommodating part, and the shrapnel is arranged in the shrapnel accommodating part, when the shrapnel is abutted against the antenna, the shrapnel is hidden in the shrapnel accommodating part of the PCB by utilizing the thickness of the PCB, the signal processing element processes the outside wireless signals received by the antenna through the shrapnel, and the overall thickness of the mobile phone is not influenced by the thickness of the shrapnel, so that the overall thickness of the mobile phone is favorably reduced.

Description

technical field [0001] The invention relates to the technical field of communication, in particular to a mobile phone, a signal receiving device and a manufacturing method thereof. Background technique [0002] The existing mobile phone includes a front shell and a rear shell. The front shell and the rear shell are fastened together to form a cavity. A PCB (Printed Circuit Board) and an FPC antenna (Flexible Printed Circuit) are arranged in the cavity. There is a metal shrapnel between them, and the cavity must be able to accommodate the PCB board, FPC antenna and metal shrapnel. Such as figure 1 As shown, the metal shrapnel 1 is fixed on the PCB board 3. When the metal shrapnel 1 is in contact with the FPC antenna 2, because the metal shrapnel 1 is exposed on the PCB board 3, it needs to occupy more thickness space, resulting in a thick cavity. As a result, the overall thickness of the mobile phone is relatively thick. For this reason, there are deficiencies in the arran...

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Problems solved by technology

[0003] In view of the deficiencies in the prior art, the object of the present invention is to provide a mobile phone, a signal receiving device and a manufacturing method thereof. When the shrapnel contacts the antenna, the shrapnel is hidden in the shrapnel receiving part of the PCB board, aiming to solve the problem caused by the thickness of the shrapnel itself. , while increasing the overall thickness of the phone

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