Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Functional module and electronic equipment

A module and function technology, applied in electrical digital data processing, character and pattern recognition, instruments, etc., can solve the problem that the thickness of functional modules cannot be reduced, and achieve the effect of reducing the thickness

Pending Publication Date: 2020-05-08
VIVO MOBILE COMM CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a functional module and electronic equipment to solve the problem that the thickness of the functional module cannot be reduced in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Functional module and electronic equipment
  • Functional module and electronic equipment
  • Functional module and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0022] Aiming at the problem that the thickness of the functional module cannot be reduced in the prior art, the present invention provides a functional module, such as Figure 1 to Figure 6 shown, including:

[0023] protective layer 1;

[0024] An encapsulation layer 2 connected to the protective layer 1, the encapsulation layer 2 is provided with a preset chip 3 and a connecting wire 4;

[0025] The connection layer 5 connected to the packaging la...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a functional module and electronic equipment, and the functional module comprises a protection layer; a packaging layer which is connected with the protective layer, wherein a preset chip and a connecting wire are arranged in the packaging layer; and a connecting layer which is connected with the packaging layer, a step-shaped structure sunken towards the connecting layer isarranged at the end corner, away from the connecting layer, of the preset chip, the first end of the connecting wire is connected with the step-shaped structure, and the second end of the connectingwire is connected with the connecting layer; wherein the maximum distance value between a point on the connecting line and the connecting layer is smaller than or equal to the maximum distance value between the upper surface of the preset chip and the connecting layer; wherein the upper surface of the preset chip is the surface, deviating from the connecting layer, of the preset chip. According tothe scheme, the function of the functional module is not influenced while the thickness of the packaging layer is reduced, so that the reduction of the thickness of the functional module is better realized.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a functional module and electronic equipment. Background technique [0002] With the advancement of intelligence, electronic equipment products have become a part of people's lives. At the same time, the requirements for electronic equipment products are getting higher and higher, such as the demand for miniaturization, long battery life, durability and reliability of electronic equipment. While the device design needs to be miniaturized and modularized as much as possible, it is also necessary to ensure the reliability of the module to be better; however, while ensuring the miniaturization, modularization and reliability strength, it will bring some other problems: Take the fingerprint module as an example. In order to ensure the miniaturization, modularization and reliability of electronic equipment, the current design of the capacitive fingerprint module is to pac...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00G06F3/044
CPCG06F3/044G06V40/1306
Inventor 袁艳清王建峰
Owner VIVO MOBILE COMM CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com