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Substrate cleaning device and method

A technology for cleaning devices and substrates, used in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc. The effect of saving the installation space

Active Publication Date: 2014-06-11
ACM RES SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In some processes, in order to obtain a better cleaning effect, it is necessary to use a combination of tank cleaning and single-wafer cleaning to clean the substrate, while the existing tank cleaning device and single-wafer cleaning device are completely independent and separate Set of equipment, the substrate is cleaned and dried in the tank cleaning device, and then put into the single chip cleaning device for cleaning and drying, resulting in long cleaning process cycle and high cleaning cost

Method used

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  • Substrate cleaning device and method
  • Substrate cleaning device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] see figure 1 , is a top view of the first embodiment of the substrate cleaning apparatus of the present invention. The substrate cleaning device of the present invention includes a loading port 110 , a first manipulator 120 , a single wafer cleaning chamber 130 , a second manipulator 140 and a tank-type cleaning chamber 150 .

[0023] The load port 110 is used to load dry substrates. The first manipulator 120 is arranged between the loading port 110 and the single-wafer cleaning chamber 130, and is used to transfer the dry state substrate between the loading port 110 and the single-wafer cleaning chamber 130. The first manipulator 120 has one or more mechanical The arm 121 is used to transfer dry substrates. The single-piece cleaning chamber 130 is used for cleaning and drying the temporarily stored substrates or single-piece substrates. The single-piece cleaning chamber 130 has a first valve 131 and a second valve 132 for transferring dry substrates and dry / wet subst...

Embodiment 2

[0033] see Figure 4 , is a top view of the second embodiment of the substrate cleaning apparatus of the present invention. The substrate cleaning device of the present invention includes a loading port 410 , a first manipulator 420 , a single wafer cleaning chamber 430 , a second manipulator 440 , a tank-type cleaning chamber 450 and a buffer device 460 .

[0034] The load port 410 is used to load dry substrates. The first manipulator 420 is used for transferring the dry substrate between the loading port 410 , the single-wafer cleaning chamber 430 and the buffer device 460 . The first manipulator 420 has one or more robot arms 421 for transferring the dry substrate. The single-piece cleaning chamber 430 is used for cleaning and drying the single-piece substrate. The single-piece cleaning chamber 430 has a first valve 431 and a second valve 432 for transferring dry substrates and dry / wet substrates, respectively. The second manipulator 440 is used to transfer the dry / wet su...

Embodiment 3

[0041] see Figure 5 and Figure 6 , is a schematic diagram of a third embodiment of the substrate cleaning apparatus of the present invention. The substrate cleaning device of the present invention includes a loading port 510 , a first manipulator 520 , a single-wafer cleaning chamber 530 , a second manipulator 540 , a tank-type cleaning chamber 550 , a first buffer device 560 and a second buffer device 570 .

[0042] The load port 510 is used to load dry substrates. The first manipulator 520 is used for transferring the dry substrate between the load port 510 , the first buffer device 560 and the second buffer device 570 , and the first manipulator 520 has one or more robot arms 521 for transferring the dry substrate. There are at least two single-piece cleaning chambers 530, which are located on the same side of the first buffer device 560 and the second buffer device 570, and are used for cleaning and drying the single-piece substrate. Each single-piece cleaning chamber ...

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PUM

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Abstract

The invention discloses a substrate cleaning device. The substrate cleaning device comprises at least one single chip cleaning cavity for cleaning and drying single chip substrates, at least one slot type cleaning cavity for soaking, cleaning and / or drying multi-chip substrate, a first mechanism arm used for putting dry substrates in or taking the dry substrates out of the single chip cleaning cavity, and a second mechanical arm used for conveying the substrates between the single chip cleaning cavity and the slot type cleaning cavity. By combining slot type cleaning and single chip cleaning, the substrate cleaning device can clean the substrates in a slot type mode as well as a single chip mode or a combined mode; after being cleaned in the slot type cleaning cavity, the substrates can be directly conveyed into the single chip cleaning cavity, without being dried, for further cleaning and drying, so that the cycle of the whole process can be shortened, the process cost can be reduced, separation between wet substrates and dry substrates can be achieved, and breakthrough in the semiconductor cleaning technology can be obtained. The invention also discloses a substrate cleaning method.

Description

technical field [0001] The invention relates to the technical field of semiconductor device manufacturing, in particular to a semiconductor substrate cleaning device and a cleaning method. Background technique [0002] For the semiconductor industry, with the continuous shrinking of the critical dimensions of semiconductor devices and the introduction of new materials, in the manufacturing process of semiconductor devices, the requirements for the cleanliness of semiconductor substrates such as wafer surfaces are becoming more and more stringent. At the same time, due to the The reduction of critical dimensions narrows the process window for cleaning, which makes it difficult to satisfy substrate cleaning efficiency while minimizing substrate surface scratches and structural damage. Nowadays, the removal of pollutants on substrates The ability and the degree of scratching and structural damage on the substrate surface are increasingly demanding. Contaminants such as particle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/04B08B13/00
CPCB08B3/04B08B13/00
Inventor 王晖陶学成陈福平
Owner ACM RES SHANGHAI
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