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Substrate cleaning device and cleaning method

A technology for cleaning devices and substrates, applied in cleaning methods and appliances, cleaning methods using liquids, chemical instruments and methods, etc., can solve problems such as high cleaning costs and long cleaning process cycles, and achieve reduced process costs and improved cleaning effects , The effect of saving the space occupied by the device

Active Publication Date: 2018-01-16
ACM RES SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In some processes, in order to obtain a better cleaning effect, it is necessary to use a combination of tank cleaning and single-wafer cleaning to clean the substrate, while the existing tank cleaning device and single-wafer cleaning device are completely independent and separate Set of equipment, the substrate is cleaned and dried in the tank cleaning device, and then put into the single chip cleaning device for cleaning and drying, resulting in long cleaning process cycle and high cleaning cost

Method used

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  • Substrate cleaning device and cleaning method
  • Substrate cleaning device and cleaning method

Examples

Experimental program
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Effect test

Embodiment 1

[0022] see figure 1 , which is a top view of the first embodiment of the substrate cleaning apparatus of the present invention. The substrate cleaning apparatus of the present invention includes a loading port 110 , a first robot 120 , a single-chip cleaning chamber 130 , a second robot 140 and a tank cleaning chamber 150 .

[0023] The load port 110 is used to load dry substrates. The first robot 120 is disposed between the load port 110 and the single-wafer cleaning chamber 130 for transferring dry substrates between the load port 110 and the single-wafer cleaning chamber 130, and the first robot 120 has one or more mechanical The arm 121 is used to transport the dry substrate. The single-wafer cleaning chamber 130 is used for cleaning and drying temporary storage substrates or single-wafer substrates. The single-wafer cleaning chamber 130 has a first valve 131 and a second valve 132 for transferring dry substrates and dry / wet substrates, respectively. . The first valve ...

Embodiment 2

[0033] see Figure 4 , which is a top view of the second embodiment of the substrate cleaning apparatus of the present invention. The substrate cleaning apparatus of the present invention includes a loading port 410 , a first robot 420 , a single-wafer cleaning chamber 430 , a second robot 440 , a tank cleaning chamber 450 and a buffer device 460 .

[0034] Load port 410 is used to load dry substrates. The first robot 420 is used for transferring dry substrates between the load port 410 , the single-wafer cleaning chamber 430 and the buffer device 460 , and the first robot 420 has one or more robot arms 421 for transferring the dry substrates. The single-wafer cleaning chamber 430 is used for cleaning and drying single-wafer substrates, and the single-wafer cleaning chamber 430 has a first valve 431 and a second valve 432 for transferring dry substrates and dry / wet substrates, respectively. The second robot 440 is used for transferring dry / wet substrates between the single-w...

Embodiment 3

[0041] see Figure 5 and Image 6 , is a schematic diagram of the third embodiment of the substrate cleaning apparatus of the present invention. The substrate cleaning apparatus of the present invention includes a load port 510 , a first robot 520 , a single wafer cleaning chamber 530 , a second robot 540 , a tank cleaning chamber 550 , a first buffer device 560 and a second buffer device 570 .

[0042] Load port 510 is used to load dry substrates. The first robot 520 is used for transferring dry substrates between the load port 510 , the first buffer device 560 and the second buffer device 570 , and the first robot 520 has one or more robot arms 521 for transferring dry substrates. There are at least two single-wafer cleaning chambers 530 located on the same side of the first buffer device 560 and the second buffer device 570 for cleaning and drying single-wafer substrates. Each single-wafer cleaning chamber 530 has a valve 531 For transporting dry / wet substrates. The sec...

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Abstract

The invention discloses a substrate cleaning device. The substrate cleaning device comprises at least one single chip cleaning cavity for cleaning and drying single chip substrates, at least one slot type cleaning cavity for soaking, cleaning and / or drying multi-chip substrate, a first mechanism arm used for putting dry substrates in or taking the dry substrates out of the single chip cleaning cavity, and a second mechanical arm used for conveying the substrates between the single chip cleaning cavity and the slot type cleaning cavity. By combining slot type cleaning and single chip cleaning, the substrate cleaning device can clean the substrates in a slot type mode as well as a single chip mode or a combined mode; after being cleaned in the slot type cleaning cavity, the substrates can be directly conveyed into the single chip cleaning cavity, without being dried, for further cleaning and drying, so that the cycle of the whole process can be shortened, the process cost can be reduced, separation between wet substrates and dry substrates can be achieved, and breakthrough in the semiconductor cleaning technology can be obtained. The invention also discloses a substrate cleaning method.

Description

technical field [0001] The present invention relates to the technical field of semiconductor device manufacturing, and in particular, to a semiconductor substrate cleaning device and a cleaning method. Background technique [0002] For the semiconductor industry, with the continuous reduction of the critical dimensions of semiconductor devices and the introduction of new materials, the requirements for the cleanliness of semiconductor substrates such as wafer surfaces are becoming more and more stringent during the manufacturing process of semiconductor devices. The shrinking of critical dimensions has narrowed the process window for cleaning, making it less easy to meet substrate cleaning efficiency while minimizing substrate surface scratches and structural damage. Today, the removal of contaminants on substrates The requirements for the ability and degree of etching and structural damage on the surface of the substrate are getting higher and higher. remove. [0003] At ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B3/04B08B13/00
CPCB08B3/04B08B13/00
Inventor 王晖陶学成陈福平
Owner ACM RES SHANGHAI
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