Laser composite punching method for ceramics
A kind of hole ceramics and laser technology, which is applied in the field of laser composite hole punching ceramics, can solve the problems of affecting product processing quality, micro cracks and recasting layers, etc., and achieve the effects of low device cost, good processing quality and avoiding damage
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[0024] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.
[0025] Laser processing technology is a technology that uses the characteristics of the interaction between laser beams and substances to perform drilling, cutting, welding, surface treatment, micromachining, as a light source, and object recognition on materials (including metals and non-metals). The traditional application is the largest. The field of the company is laser processing technology, and the laser processing system includes lasers, light guide systems, processing machine tools, control systems and detection systems.
[0026] see figure 2 , a method for laser composite drilling ceramics, comprising:
[0027] S1. Select the hole to be drilled on the ceramic body;
[0028] The thickness of the ceramic plate is: 0.8mm-2mm.
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