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Heat dissipation device and heat dissipation method for a pulsed high-power laser

A high-power laser and heat dissipation device technology, applied in the direction of laser cooling devices, laser components, etc., can solve the problems of fast heat dissipation process, affecting other instruments, and large heat dissipation, so as to avoid burns, prolong working time and reduce temperature. Effect

Active Publication Date: 2017-02-22
SUZHOU WEIMU INTELLIGENT SYST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the present invention is to solve the problem of affecting other instruments or scalding people caused by the rapid heat dissipation process in the prior art and the large amount of heat emitted. Heat dissipation device and method for prolonging working time of pulsed high-power laser

Method used

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  • Heat dissipation device and heat dissipation method for a pulsed high-power laser
  • Heat dissipation device and heat dissipation method for a pulsed high-power laser

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Effect test

Embodiment 1

[0034] The cooling device of the pulsed high-power laser of the present invention, such as figure 2 As shown, it includes a heat conduction device bonded to the laser 7, and the heat conduction device includes a semiconductor cooling chip 9 and a heat conducting metal block 10 in this embodiment, and the cold end of the semiconductor cooling chip 9 is directly bonded to the laser 7 One end of the heat-conducting metal block 10 is bonded to the hot end of the semiconductor cooling plate 9, and the other end is connected to the heat-conducting tube 11. In this embodiment, the heat-conducting tube 11 extends into the inside of the heat-conducting metal block 10 , to better transfer heat.

[0035] The present invention is more suitable for pulsed high-power lasers. The heat conduction device is connected with at least one heat conduction tube 11. The number of the heat conduction tubes 11 is set according to the internal space of the device and needs. In this embodiment, the heat...

Embodiment 2

[0041] On the basis of the heat dissipation device of the pulsed high-power laser described in Embodiment 1, the contact surface of the semiconductor cooling plate 9 and the laser 7 is evenly coated with a heat-conducting material 8; the heat-conducting metal block 10 in this embodiment is Red copper, the surface of the heat-conducting metal block 10 is evenly coated with a heat-conducting material 8; the heat-conducting material 8 adopts heat-conducting silicone grease in this embodiment, and the soft heat-conducting silicone grease can ensure that the contact area between each device is the largest. In order to improve thermal conductivity, the thermal conductive material 8 can also use other materials, such as thermal conductive material 8 such as thermal conductive paste, heat dissipation paste, heat dissipation silicone grease, etc.

[0042] The contact part between the heat pipe 11 and the phase change material 12 is sealed, and the heat pipe 11 can adopt a threaded pipe,...

Embodiment 3

[0045] A heat dissipation method adopting the heat dissipation device of the pulsed high-power laser described in the above embodiments comprises the following steps:

[0046] (1) The heat generated by the laser 7 is absorbed by the cold end of the semiconductor cooling plate 9 in the heat conduction device, and transferred to the heat conduction metal block 10, that is, red copper through its hot end, and the heat is absorbed by the red copper and then passed through One or more of the heat pipes 11 are transferred to the phase change wax;

[0047] (2) The phase-change wax absorbs the heat transferred by the heat pipe 11 and stores it, and the heat stored in the phase-change wax slowly dissipates to the outside through the shell 13 in contact with it.

[0048] The heat dissipation method also includes: part of the heat absorbed by the heat-conducting metal block 10 is directly dissipated to the outside through the shell 13 in contact with it; and most of the heat is absorbed ...

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Abstract

A heat dissipation structure of a pulse type high-power laser comprises a heat conduction apparatus fitted with a laser, the heat conduction apparatus is connected with at least one heat conduction tube, one end of the heat conduction tube is connected with the heat conduction apparatus, and the other end extends into a sealing phase change material. According to the pulse type high-power laser, the heat of the high-power laser in pulse type working is transferred to the phase change material for absorption through the heat conduction apparatus and the conduction tube, and the phase change material first stores the heat generated by the high-power laser in pulse type working and releases the heat slowly, the stable working time of the laser can be prolonged, and the heat exchange speed of the laser with the external environment of a system can be reduced, so that the quick heat dissipation affecting other apparatus and members and scalding to a user can be avoided.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device and method for a pulsed high-power laser. Background technique [0002] With the development of modern industry, the application of high-power lasers has been involved in many fields of people's social life, such as detection, processing, communication, etc. It has broad prospects and huge potential markets, and is a research hotspot all over the world. The main problem faced by high-power lasers at present is the short stable working time of lasers, which limits their practical applications to a large extent. The stable working time of the laser is mainly related to the heat dissipation of the laser. Due to factors such as conversion efficiency, the integration of light-emitting devices leads to heat enrichment, which will cause the junction temperature of the active region of the laser to rise, thereby reducing the photoelectric conversion efficiency of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S3/04
Inventor 李鹏姜守望汪小知
Owner SUZHOU WEIMU INTELLIGENT SYST CO LTD
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