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Compositions for low K, low temperature co-fired composite (LTCC) tapes and low shrinkage, multi-layer LTCC structures formed therefrom

A composition and glass composition technology, applied in the direction of circuit substrate materials, thin material processing, inorganic insulators, etc., can solve problems such as non-relief, and achieve the effect of low shrinkage and low overall dimensional stability

Active Publication Date: 2014-04-23
DUPONT ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] Commonly assigned USP 7,175,724 describes the use of symmetry as a solution, i.e., using dummy, non-functional compensating layers to balance the asymmetric and functional parts of the structure, but states that it does not ease the need for building All disadvantages of the LTCC structural challenge solution

Method used

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  • Compositions for low K, low temperature co-fired composite (LTCC) tapes and low shrinkage, multi-layer LTCC structures formed therefrom
  • Compositions for low K, low temperature co-fired composite (LTCC) tapes and low shrinkage, multi-layer LTCC structures formed therefrom
  • Compositions for low K, low temperature co-fired composite (LTCC) tapes and low shrinkage, multi-layer LTCC structures formed therefrom

Examples

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example

[0088] The tape compositions used in the examples were prepared by ball milling finely divided inorganic powders and binders in volatile solvents or mixtures thereof. For optimization of lamination, ability to form circuit patterns, tape burnout performance, and post-firing microstructure formation, the following volume % paste formulations were found to provide advantages. As with a practical basis, formulations of typical slurry compositions are also shown in weight percent. The glass in the inorganic phase is assumed to have a specific gravity of 3.5 g / cc and the alumina to be 4.0 g / cc, and the organic vehicle is assumed to have a specific gravity of 1.1 g / cc. Therefore, when using glass and oxides other than alumina, the weight % composition changes because the specific gravity may be different from those assumed in this example.

[0089] The volume and weight % of the above slurry composition can be varied depending on the amount of organic solvent and / or solvent blend d...

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Abstract

The present invention provides novel compositions for LTCC green tapes having low K values and low shrinkage and composite laminates of ten to twenty layers or more of green tapes together with conventional LTCC green tapes.

Description

technical field [0001] The present invention relates to the preparation of LTCC green tapes having low K values ​​and low shrinkage, novel compositions capable of tailoring these low K values, and at least two such low K, low shrinkage LTCC green tapes together with a shrinkage value of 7 % to 8% conventional LTCC green tape together to make a composite laminate of ten to twenty or more layers of green tape, wherein the composite laminate exhibits about 1 % to 1.25% shrinkage. Background technique [0002] General LTCC [0003] An interconnected circuit board is the physical realization of an electronic circuit or subsystem composed of a large number of extremely small circuit elements that are electrically and mechanically interconnected. In many cases, it is desirable to combine these different types of electronic components in an arrangement so that they can be physically separated in a single compact package, assembled adjacent to each other, and electrically connecte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C3/068C03C14/00H01B3/08H05K1/03
CPCH05K3/4629C03C12/00H05K1/0306H01B3/085Y10T428/24942
Inventor K·M·奈尔M·F·麦库姆斯S·C·比尔斯
Owner DUPONT ELECTRONICS INC
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