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Method for preparing low temperature co-fired ceramic substrate cavity structure

A technology of low-temperature co-fired ceramics and substrates, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of increasing the complexity and cost of LTCC substrate preparation processes, achieve easy operation, simple process, and solve pollution problems. cavity effect

Active Publication Date: 2018-01-16
ZHEJIANG SIRAMIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, this method has many disadvantages. For example, in order to ensure the flatness of the cavity, the size of the sacrificial layer material and the cavity size of the green ceramic tape must be completely matched; Designing additional exhaust channels on the LTCC substrate, constantly adjusting the sintering process, etc., thus increasing the complexity and cost of the LTCC substrate preparation process

Method used

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  • Method for preparing low temperature co-fired ceramic substrate cavity structure
  • Method for preparing low temperature co-fired ceramic substrate cavity structure
  • Method for preparing low temperature co-fired ceramic substrate cavity structure

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preparation example Construction

[0039] figure 1 It is a schematic flowchart showing a method for preparing a cavity structure of an LTCC substrate 1 according to an embodiment of the present invention. in the figure 1 In the shown embodiment, the method for preparing the cavity structure of the LTCC substrate 1 of the present invention has the following steps: cutting the rolled LTCC green ceramic tape into several pieces of LTCC green ceramic sheets 1A, and then cutting the partially cut pieces The LTCC green ceramic sheets 1A are stacked in the first stage in sequence, thereby forming the upper cover plate 2 and the lower layer plate 4 respectively; in addition, several pieces of LTCC green ceramic sheets 1A that have been cut are punched, and then several pieces of LTCC green ceramic sheets that have been punched are punched. The green ceramic sheet 1A is laminated in the first stage in order to form a sub-layer 3 with a cavity structure; the sub-layer 3 and the lower layer 4 are laminated in the second ...

Embodiment 1）

[0048] According to the preparation method of the cavity structure of the LTCC substrate 1 according to Embodiment 1 of the present invention, the specific steps are as follows:

[0049] First of all, the cut 5 pieces of LTCC green ceramic sheets 1A are sequentially put into the stacker for the first stage of stacking. In the stacking process, the stacking pressure is 5 MPa, the stacking temperature is 65° C., and the stacking time is 120 seconds, thereby making the upper cover plate 2 of the cavity structure of the LTCC substrate 1 . Then the cut 15 pieces of LTCC green ceramic sheets 1A are sequentially put into the stacker for the first stage of stacking, and the lower layer plate 4 of the cavity structure of the LTCC substrate 1 is made.

[0050] Then, 10 LTCC green ceramic sheets 1A were drilled, and according to the design height of the cavity structure, the first stage was carried out on the 10 LTCC green ceramic sheets 1A that had been drilled using the same process co...

Embodiment 2）

[0054] According to the preparation method of the cavity structure of the LTCC substrate 1 according to Embodiment 2 of the present invention, the specific steps are as follows:

[0055] First, put the cut 10 pieces of LTCC green ceramic sheets 1A into the lamination machine in turn for the first stage of lamination. In the lamination process, the lamination pressure is 3 MPa, the lamination temperature is 55° C., and the lamination time is 90 seconds, thus the upper cover plate 2 of the cavity structure of the LTCC substrate 1 is manufactured. Then the cut 15 pieces of LTCC green ceramic sheets 1A are sequentially put into the stacker for the first stage of stacking, and the lower layer plate 4 of the cavity structure of the LTCC substrate 1 is made.

[0056] Then, 10 LTCC green ceramic sheets 1A were drilled, and according to the design height of the cavity structure, the first stage was carried out on the 10 LTCC green ceramic sheets 1A that had been drilled using the same ...

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Abstract

The method for preparing a low temperature co-fired ceramic substrate cavity structure comprises the following steps: cutting a LTCC (Low Temperature Co-fired Ceramic) green tape into LTCC green sheets; sequentially performing first-stage lamination of the LTCC green sheets after cutting to form an upper cover plate, a sub-layer plate and a lower plate; performing second-stage lamination of the sub-layer plate and the lower plate to form a laminated plate; and performing lamination of the upper cover plate and the laminated plate to form a LTCC bar block; and performing cutting of the LTCC barblock to form a LTCC substrate biscuit, and performing sintering of a LTCC substrate, wherein the lamination pressure, temperature and time in the technology of the third-stage lamination are all smaller than parameters in the technologies in the first-stage and second-stage laminations. According to the invention, the manufacturing cost of a low-temperature co-fired ceramic substrate with a cavity structure can be greatly reduced so as to facilitate batch production of a low-temperature co-fired ceramic substrate cavity structure.

Description

technical field [0001] The invention relates to the field of manufacturing a low-temperature co-fired ceramic substrate, in particular to a method for preparing a cavity structure of a low-temperature co-fired ceramic substrate. Background technique [0002] Low Temperature Co-fired Ceramic (hereinafter referred to as LTCC) technology is widely used as a mature multi-layer substrate technology. It laminates and co-fires thick-film printed green ceramic tapes to make the circuit The design space has been expanded from the traditional two-dimensional plane to the three-dimensional space. The cavity structure constructed by LTCC technology is very suitable for embedding passive devices, thus greatly reducing the size of components and the area of ​​packaging substrates. In addition, the cavity structure in the LTCC substrate is also widely used in LTCC microfluidic channels, LTCC microreactors, LTCC sensors, LTCC drivers, and LTCC multifunctional integrated substrates and othe...

Claims

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Application Information

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IPC IPC(8): H01L21/48
Inventor 马名生林琳刘志甫李永祥
Owner ZHEJIANG SIRAMIC TECH CO LTD
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