Substrate, alignment mark manufacturing method thereof and display device
A manufacturing method and alignment mark technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as reduced contrast, lower film overlap accuracy, and difficulty in identifying alignment marks
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[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0028] An embodiment of the present invention provides a substrate, such as Figure 4 As shown, it may include a first film layer 21 and a second film layer 22 located on the surface of the first film layer 21 ; there is at least one alignment mark 20 between the first film layer 21 and the second film layer 22 .
[0029] Wherein, the thickness H of the second film layer 22 corresponding to the position corresponding to the position mark 20 may be smaller than...
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