Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-voltage ESD protective device with dual latch-up resistance and of annular LDMOS-SCR structure

A LDMOS-SCR, ESD protection technology, applied in electric solid devices, semiconductor devices, electrical components, etc., can solve the problems of low trigger voltage, weak anti-latch ability, etc., achieve low trigger voltage, increase area, improve maintenance The effect of voltage

Active Publication Date: 2014-03-26
NANTONG JIANGHUA MASCH CO LTD
View PDF7 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Aiming at the problem of weak latch-up resistance in the existing high-voltage ESD protection technology, this paper proposes a technical solution with high sustain voltage, high sustain current, low trigger voltage and strong robustness, which can enhance the on-chip power integrated circuit system reliability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-voltage ESD protective device with dual latch-up resistance and of annular LDMOS-SCR structure
  • High-voltage ESD protective device with dual latch-up resistance and of annular LDMOS-SCR structure
  • High-voltage ESD protective device with dual latch-up resistance and of annular LDMOS-SCR structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028]The present invention proposes a high-voltage ESD protection device with a double anti-latch-up annular LDMOS-SCR structure. Because it is mainly used in the field of high-voltage ESD protection, it needs to be based on a high-voltage BCD process platform, through reasonable design and control of certain features of the device layout parameters, ESD protection devices with different specifications that can meet various high-voltage ESD protection requirements can be prepared.

[0029] A high-voltage ESD protection device with double anti-latch-up annular LDMOS-SCR structure, which includes the ESD current discharge path of the LDMOS-SCR structure and the ESD current discharge path of Zener breakdown, and the layout of the annular LDMOS-SCR structure designed to increase hold voltage, hold current, and enhance ESD robustness of the device. It is characterized by: including P-type substrate 101, N-type buried layer 102, first P well 103, first N well 104, second P well 105...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a high-voltage ESD protective device with dual latch-up resistance and of an annular LDMOS-SCR structure. The high-voltage ESD protective device with the dual latch-up resistance and of the annular LDMOS-SCR structure can be applied to an on-chip IC. The high-voltage ESD protective device with the dual latch-up resistance and of the annular LDMOS-SCR structure comprises a P type substrate, an N type buried layer, a first P trap, a first N trap, a second P trap, a P adulterant, a second N trap, a third P trap, an isolation area, a first P+, a first N+, a second N+, a second P+, a third N+, a third P+, a fourth N+, a fourth P+, a fifth N+, a sixth N+, a fifth P+, a metal anode and a metal cathode, wherein a Zener breakdown ESD current discharging path is formed by the second N+, the second P+, the first N+ and the first P+ or by the fourth P+, the fifth N+, the sixth N+ and the fifth P+. According to the high-voltage ESD protective device with the dual latch-up resistance and of an annular LDMOS-SCR structure, the ESD robustness of the device can be improved, the maintaining voltage can be improved, and the trigger voltage can be reduced; due to the design of the annular layout of the LDMOS-SCR structure, the on resistance can be reduced, and the maintaining current can be improved; the ESD protective capacity of the dual latch-up resistance is achieved.

Description

technical field [0001] The invention belongs to the field of electrostatic protection of integrated circuits and relates to a high-voltage ESD protection device, in particular to a high-voltage ESD protection device with a double anti-latch ring LDMOS-SCR structure, which can be used to improve the reliability of on-chip IC high-voltage ESD protection. Background technique [0002] With the widespread use of automotive electronics, handheld terminals, high-speed USB interfaces, and tablet electronics, consumer electronics are facing increasingly severe challenges to system reliability. Static electricity is a common physical phenomenon. With the rapid development of integrated circuits and the wide application of polymer materials in recent years, the damage caused by the force, discharge and induction of static electricity is very serious. According to the statistics of the relevant departments of the United States, the annual loss of the US electronics industry due to elec...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L27/02H01L29/06H01L29/423
Inventor 梁海莲顾晓峰董树荣丁盛
Owner NANTONG JIANGHUA MASCH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products