Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printed wiring board cleaning agent and use method thereof

A technology for printed circuit boards and cleaning agents, applied in the direction of using liquid cleaning methods, cleaning methods and utensils, detergent compositions, etc., can solve the problem of affecting the welding effect of printed circuit boards, unfavorable large-scale promotion and application, and improving enterprise Production costs and other issues, to achieve the effect of cleaning printed circuit boards, the best cleaning effect, and improve efficiency

Inactive Publication Date: 2014-03-12
深圳市华大电路科技有限公司
View PDF4 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the stains on the printed circuit board cannot be completely removed, it will greatly affect the subsequent soldering effect of the printed circuit board
[0003] At present, most cleaning agents have many defects such as large foam, difficult to clean, bad smell, and strong toxicity; some cleaning agents usually add defoamers to them in order to reduce the foam generated during the washing process, which is harmful to the environment. Unfriendly; foreign cleaning agents are effective, but the price is high, and long-term use will greatly increase the production cost of the enterprise, which is not conducive to large-scale promotion and application, and cannot meet the needs of the country and enterprises for energy conservation, environmental protection and sustainable development

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed wiring board cleaning agent and use method thereof
  • Printed wiring board cleaning agent and use method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The preparation method of the cleaning agent of the present embodiment is as follows: Weigh 300g dipropylene glycol methyl ether, 26gFMEE, 26g cocoamide diethanolamine, 5g sodium laurylsulfonate, 5g sodium carbonate, 5g sodium silicate, 1700g deionized water , Mix the components evenly under normal temperature and pressure to obtain the printed circuit board cleaning agent.

[0025] In addition to using this cleaning agent in the conventional method, the following method can also be used to clean the printed circuit board to achieve better cleaning effect: add the above printed circuit board cleaning agent into the ultrasonic cleaning machine, and then put the printed circuit board Put into an ultrasonic cleaning machine for cleaning, the power of the ultrasonic cleaning machine is preferably 0.5-0.7KW, the cleaning time is 10min, and the cleaning temperature is 35-40°C, and the printed circuit board after cleaning is dried and set aside.

[0026] The processed printed ...

Embodiment 2

[0028] The preparation method and usage method of the present embodiment are the same as in Example 1, the difference is that its components and contents are: 300g of dipropylene glycol methyl ether, 32.6g of FMEE, 26g of cocoamide diethanolamine, 5g of sodium laurylsulfonate, Sodium carbonate 6.4g, sodium silicate 5g, deionized water 1700g.

[0029] The binding test was carried out on the processed printed circuit board, and the pass rate of the first and second welds was 100%, and the pass rate of the gold wire pull test was 70%.

Embodiment 3

[0031] The preparation method and usage method of this embodiment are the same as in Example 1, the difference is that its components and contents are: dipropylene glycol methyl ether 30g, FMEE2g, cocoamide diethanolamine 2.5g, sodium dodecylsulfonate 0.5g, Sodium carbonate 1g, sodium silicate 0.5g, deionized water 170g.

[0032] The binding test was carried out on the processed printed circuit board, and the pass rate of the first and second welds was 100%, and the pass rate of the gold wire pull test was 50%.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A printed wiring board cleaning agent comprises the following components in parts by weight: 20-60 parts of a dispersing agent, 1-5 parts of FMEE, 1-6 parts of coconut diethanolamide, 0.1-2.5 parts of sodium dodecyl sulfate, 0.5-10 parts of a washing assistant and 20-500 parts of deionized water, wherein the dispersing agent is one or more of isopropyl alcohol, dipropylene glycol or tripropylene glycol; the washing assistant comprises sodium carbonate and sodium silicate in the weight ratio of 0.5:1-4:1. According to the cleaning agent, the sodium carbonate and the sodium silicate are added simultaneously to be used as the washing assistant, so that a better cleaning function for a printed wiring board is achieved in comparison with the addition of other washing assistants or a washing assistant with only the sodium carbonate or the sodium silicate, and the primary welding and secondary welding qualification rate and the gold thread tensile force testing qualification rate of the printed wiring board are improved. Particularly, when the sodium carbonate and the sodium silicate are in the rate of 1:1, the cleaning performance of the washing assistant is best.

Description

technical field [0001] The invention relates to a cleaning agent for a printed circuit board and a method for using the same. Background technique [0002] In order to obtain high-quality solder joints, the printed circuit board is usually cleaned with a cleaning agent to remove stains on the printed circuit board and keep the soldered joints of the printed circuit board clean. If the stain on the printed circuit board cannot be completely removed, it will greatly affect the subsequent soldering effect of the printed circuit board. [0003] At present, most cleaning agents have many defects such as large foam, difficult to clean, bad smell, and strong toxicity; some cleaning agents usually add defoamers to them in order to reduce the foam generated during the washing process, which is harmful to the environment. Unfriendly; foreign cleaning agents are effective, but the price is high, and long-term use will greatly increase the production cost of the enterprise, which is no...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C11D1/83C11D3/60C11D3/20B08B3/12B08B3/08
Inventor 鲁吉志陈韵竹汪传林丁爱平李明
Owner 深圳市华大电路科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com