Preparation method of high-purity silicon carbide

A technology of pure silicon carbide and silicon carbide, which is applied in the direction of silicon carbide, chemical instruments and methods, and carbides, can solve the problems that the purity cannot reach more than 99%, is not conducive to semiconductor devices, and affects the purity of silicon carbide. Reduced purity, improved production efficiency and purity, and fast response

Inactive Publication Date: 2014-02-05
TAIZHOU BEYOND TECH
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] And the preparation method of silicon carbide in the prior art adopts to spread a layer of quartz sand on the heating element, then spread a layer of coal or petroleum coke on the periphery of the quartz sand, and then spread a layer of quartz sand on the outside of the coal or petroleum coke. , and then lay a layer of coal or stone tar. The thickness of each layer of quartz sand and coal petroleum coke layer is different. After laying, it will be heated at high temperature for at least 7 days. , because quartz sand and carbon contain a large amount of impurities such as metals, these impurities also undergo chemical reactions in a high-temperature heating environment to generate smoke of various colors such as yellow and red, which are directly discharged into the atmosphere without any treatment. Serious environmental pollution; and these impurities have a greater impact on the purity of SiC itself, and the use of this method to prepare silicon carbide, due to the different distances between the raw material and the heating element, will also make the generated silicon carbide The purity is different and affects the carbonization. purity of silicon
Therefore, the silicon carbide prepared by this method pollutes the environment very much, and the purity of silicon carbide is not high, and the purity cannot reach more than 99%, which is not conducive to the materials used to prepare semiconductor devices.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of high-purity silicon carbide
  • Preparation method of high-purity silicon carbide
  • Preparation method of high-purity silicon carbide

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033]The preparation method of the high-purity silicon carbide of the present invention makes the surface of the raw material silica completely covered by a carbon source containing carbon elements to form raw material particles, and reacts the raw material particles under high temperature conditions to produce silicon carbide.

[0034] More specifically, the carbon source containing raw material carbon elements is first added to the viscous liquid. The viscous liquid is preferably an aqueous solution with a mass percentage of 5% PVA (PVA is polyvinyl alcohol). After stirring evenly, the raw material silica is soaked in In this solution or the solution is evenly stirred and then sprayed onto the surface of the silica, so that the surface of the raw silica is completely wrapped by the carbon source containing carbon elements to make raw material particles. The raw material particles can have a cross-section such as figure 1 The single silica 1 shown is completely wrapped by the...

Embodiment 2

[0038] The preparation method of this example is basically the same as that of Example 1, except that the prepared raw material particles are first mixed with a carbon source containing carbon elements and then reacted at high temperature to produce silicon carbide. Under high temperature conditions, the mixed carbon source containing carbon elements will be decomposed or partially burned, causing gaps between the raw material particles. Impurities are easier to discharge, reducing ash to participate in the reaction and producing metal impurities to diffuse into silicon carbide, thereby improving the purity of silicon carbide. Preferably, the prepared raw material particles are mixed with wood and then reacted at high temperature to produce silicon carbide. Wood undergoes partial combustion at high temperatures, causing voids to form between the raw material particles. Other content is consistent with Embodiment 1, and will not be repeated here. The purity of the obtained si...

Embodiment 3

[0040] The preparation method of this example is basically the same as that of Example 1, except that the raw material particles are mixed raw material particles with different shapes and sizes.

[0041] More specifically, as figure 2 As shown, raw material particles with different shapes and sizes are selected and screened according to the size of the raw material particles. Lay a layer of raw material particles different in size from the raw material particles in the first accumulation layer 2 to form a second accumulation layer 3, and the size of the raw material particles in the second accumulation layer is the same, and alternately accumulate in sequence according to the above-mentioned method, corresponding The third buildup layer 4, the fourth buildup layer 5, and the fifth buildup layer 6 were originally formed. The thickness of the accumulation layer formed by the accumulation of corresponding raw material particles in each layer above can be adjusted according to a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
Login to view more

Abstract

The invention relates to a preparation method of high-purity silicon carbide, and belongs to the technical field of semiconductor materials. In order to solve the problems of low purity and severe environmental pollution of silicon carbide obtained by the prior art, the invention provides a preparation method of high-purity silicon carbide. The method is as below: completely wrapping the surface of a raw material silica or metal silicon or a mixture of the two with a carbon source containing carbon element, so as to prepare raw material particles; and reacting the raw material particles under high temperature to produce the silicon carbide. The silicon carbide prepared by the method in the invention has high purity, also can reduce energy consumption and pollutant emissions, and is friendly to the environment.

Description

technical field [0001] The invention relates to a method for preparing high-purity silicon carbide, which belongs to the technical field of semiconductor materials. Background technique [0002] In recent years, silicon carbide (SiC), which has a larger band gap than commonly used silicon, has been used for semiconductor substrates for manufacturing semiconductor devices. Therefore, a semiconductor device using silicon carbide has the advantages of high breakdown voltage, low on-resistance, and less performance degradation in a high-temperature environment. However, the use of silicon carbide as a material for manufacturing semiconductor devices has higher requirements on the purity content of silicon carbide, that is to say, higher requirements are placed on the preparation of silicon carbide. [0003] The preparation method of silicon carbide in the prior art adopts a layer of quartz sand on the heating element, and then a layer of coal or petroleum coke is spread on the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C01B31/36C01B32/97C01B32/984
Inventor 星野政宏
Owner TAIZHOU BEYOND TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products