A test device for measuring the compressive creep performance of microelectronic packaging solder joints

Abstract

The invention discloses a testing device for determining compression creepage performance of microelectronic packing welding spots, belonging to the field of testing on the mechanical performance of materials. A main body of the testing device comprises an environmental box, a sample stand, a locating mechanism and a loading mechanism, wherein the upper half part of the sample stand is arranged in the environmental box, a load rod of the loading mechanism is fixedly connected with a supporting disc after sequentially penetrating through a supporting table top, the sample stand, a test sample and an upper pressure plate, and a weight tray is arranged at the lower part of the load rod. In testing, the environment box enables the test sample to reach an experimental temperature, the loading mechanism applies pressure stress load to the test sample, and an optical displacement meter mechanism or an LVDT (Linear Variable Differential Transformer) displacement meter mechanism is used for recording the displacement variation of the test sample in testing. The testing device enables the test sample to be located accurately and loaded uniformly, and the experiment accuracy can be improved. The working conditions of the microelectronic packing welding spots under conditions of different temperatures and pressure loads can be simulated through regulating the temperature of the environmental box and the number of loaded weights so as to obtain creepage data under corresponding working conditions, and especially, the testing device can meet testing demands of practical microelectronic products in production.

Description

Technical field [0001] The invention relates to a test device for determining the compression creep performance of a solder joint of a microelectronic package, and belongs to the field of material mechanical performance testing. Background technique [0002] Metal materials will creep under 0.5 times the absolute temperature of the melting point and under load. To evaluate the high-temperature mechanical properties of metal materials, the effect of creep deformation on the mechanical properties of materials must be considered. Especially in the field of microelectronic packaging, creep is important for welding. The impact of mechanical performance and reliability is very important. Because the melting point of solder commonly used in microelectronics packaging is generally lower than 230°C, even at room temperature, it has exceeded 0.5 times the absolute temperature of the solder alloy melting point. For example, the melting point of the eutectic alloy Sn-3.0Ag-0.5Cu is 217°C. R...

AI Technical Summary

Problems solved by technology

In particular, it is pointed out that the geometric particularity of the BGA package structure makes it easy to generate stress concentration in the solder joints located on the edge during service, and the stress state of the solder joints during service and the stress state in the bulk solder creep test also exist. The creep test results are not directly comparable, which makes the eigenvalues ​​representing the creep mechanism obtained in the relevant creep research: the creep activation energy and the stress index are not consistent, and the dispersion is large

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