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Manufacturing method of LED lamp and LED lamp

A technology of LED lamps and manufacturing methods, applied to parts of lighting devices, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc., capable of solving problems such as poor sealing structure and poor heat dissipation, and achieving zero light loss Luminous, simple and practical structure, high luminous efficiency

Inactive Publication Date: 2014-01-15
王树生
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  • Application Information

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Problems solved by technology

[0004] In order to overcome the technical problems of poor sealing structure and poor heat dissipation of existing high-power LED lamp beads, the present invention provides an LED lamp manufacturing method and an LED lamp with a simpler and more convenient sealing structure and better heat dissipation.

Method used

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  • Manufacturing method of LED lamp and LED lamp
  • Manufacturing method of LED lamp and LED lamp
  • Manufacturing method of LED lamp and LED lamp

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no. 4 approach

[0047] see Figure 7 , is the fourth embodiment of the present invention. In this embodiment, the method for manufacturing the LED lamp 400 of the third embodiment is mainly introduced, which includes the following steps:

[0048] Step S11 , providing an LED chip 4051 . The LED chip 4051 is connected with an LED bead electrode 4061 .

[0049] Step S12 , package the LED chip 4051 on the electrode holder 4055 or the heat sink 407 . The LED chip 4051 connected with the LED lamp bead electrode 4061 is packaged on an electrode support 4055, and the LED chip can be packaged by silver glue, silica gel, resin, tin, alloy material, eutectic solder, copper paste, tin paste, etc. 4051 is glued on the electrode holder 4055. A heat sink 407 may also be provided, and the LED chip 4051 connected with the LED lamp bead electrode 4061 is directly packaged on the heat sink 407 . During packaging, the LED chip 4051 can be bonded to the heat sink 407 by packaging to the electrode holder 4055 ...

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Abstract

An LED lamp comprises an LED lamp bead. The LED lamp bead comprises an LED chip and an LED electrode connected with the LED chip, and the LED chip is installed to an electrode support in a packaging mode. A sealing structure is utilized to seal the partial LED electrode exposed outside the electrode support to guarantee watertightness and insulation of the whole LED lamp bead. An independent airtight container is no longer needed for sealing the LED lamp, and therefore the structure of the LED lamp is simpler than that of an LED lamp in the prior art. In addition, according to the sealing method, the LED lamp bead is directly exposed outside, in an open ventilation state, luminescence with zero light loss can be achieved under the circumstance that auxiliary equipment is not needed, and meanwhile ventilation and heat dissipation of the LED lamp can be achieved in a maximized mode because of the open structure. Besides, each LED lamp bead where the sealing structure is adopted is independently provided with an independent radiator, and the radiators with the structures facilitate vertical convection of air. Therefore, the LED lamp is not only simple and practical in structure, but also better in heat dissipation effect and higher in light-emitting efficiency.

Description

【Technical field】 [0001] The invention relates to an LED lamp, in particular to a method for manufacturing an LED lamp using a novel sealing method and the LED lamp. 【Background technique】 [0002] In the traditional lighting technology, tungsten filament bulbs are mostly used. Due to the large power consumption and volume, low luminous efficiency and short life, they are increasingly unable to meet the needs of modern society. With the development of semiconductor technology, the application of LEDs with small power consumption and volume, high luminous efficiency and long life in electric light source technology has attracted more and more attention. [0003] With the advancement of technology, the application of light-emitting diodes (LIGHT EMITING DIODE, referred to as LED) is becoming more and more extensive, especially the power of LEDs is continuously improved, and LEDs are gradually extending from signal display to the field of lighting sources. In order to increase...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V19/00F21V29/00F21V31/00H01L33/00H01L33/48F21Y101/02F21V29/77F21Y115/10
Inventor 王树生
Owner 王树生
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