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Process for processing two-sided and multilayer circuit board

A processing technology and circuit board technology, which is applied in multi-layer circuit manufacturing, printed circuit, printed circuit manufacturing, etc., can solve the problems of health hazards for operators, complicated manufacturing process, and many transfer links, so as to reduce production costs and save Process flow and the effect of reducing the number of plate transfers

Active Publication Date: 2014-01-01
莆田市龙腾电子科技有限公司
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AI Technical Summary

Problems solved by technology

The current circuit board manufacturing process is complicated, especially in the pre-treatment process. In order to make the copper on the surface of the substrate more fresh and better connected with the sinking copper, it is necessary to polish and chemically treat the copper-clad surfaces on both sides of the substrate, and generally use chemical methods. Copper immersion, mainly through desmear removal, activation, and formaldehyde catalysis for copper immersion, so that the hole wall of the via hole is sunk with a layer of conductive copper. This process has many transfer links, and copper immersion needs to use more copper, and the cost is high. , and more formaldehyde is used in copper sinking, which causes environmental pollution and also brings serious harm to the health of operators

Method used

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Embodiment Construction

[0052] In order to show the effects of the present invention, the present invention will be further described below through specific examples. However, it should be understood that these examples are only for more detailed description, and should not be construed as limiting the present invention in any form.

[0053] A kind of double-sided circuit board processing technology, described double-sided circuit board processing technology comprises the following steps:

[0054] 1) Cutting, cutting the original plate into a substrate of predetermined size, the upper and lower sides of the substrate are covered with copper layers;

[0055] 2) Drilling, use a high-speed drill to drill the required via holes on the substrate cut in step 1);

[0056] 3) Coating an organic conductive film, coating the hole wall of the via hole drilled in step 2) with an organic conductive film;

[0057] 4) Thickened copper, through the action of the organic conductive film on the hole wall, uses elect...

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Abstract

The invention discloses a process for processing a two-sided and multilayer circuit board. The process includes the steps that the link that an organic electrical membrane is plated is utilized to replace pretreatment and electroless plating copper links in the process of processing a traditional circuit board, and the process of plating the organic electrical membrane is utilized to produce the circuit board. Compared with a traditional process, plate rotating links are reduced, consumption of copper, tin and other metal is saved, the production process is effectively simplified, and production cost is reduced. In addition, in the production process, formaldehyde, strong nitric acid and other hazardous substances are not used, therefore, environment friendliness is achieved, and damage to the body of operators is reduced in the process of processing the two-sided and multilayer circuit board.

Description

technical field [0001] The invention relates to circuit boards, in particular to a double-sided and multilayer circuit board processing technology. Background technique [0002] The circuit board is one of the important parts of the electronics industry. The circuit board can provide mechanical support for fixing and assembling the electronic components, and can realize the electrical connection between the electronic components. The current circuit board manufacturing process is complicated, especially in the pre-treatment process. In order to make the copper on the surface of the substrate more fresh and better connected with the sinking copper, it is necessary to polish and chemically treat the copper-clad surfaces on both sides of the substrate, and generally use chemical methods. Copper immersion, mainly through desmear removal, activation, and formaldehyde catalysis for copper immersion, so that the hole wall of the via hole is sunk with a layer of conductive copper. T...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/46
Inventor 姚志栋潘仲明
Owner 莆田市龙腾电子科技有限公司
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