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Photoelectric type high backfill earthwork settling volume testing device and mounting method thereof

A testing device and settlement technology, which can be used in measuring devices, height/level measurement, and on-site foundation soil survey, etc. It can solve problems such as construction inconvenience and errors, and achieve the effects of convenient operation, high precision and large measuring range.

Inactive Publication Date: 2014-01-01
HEFEI UNIV OF TECH
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the rolling of the connecting rod of the buried settlement plate during the earthwork construction, as well as the extension, verticality, boundary resistance, etc. of the connecting rod of the settlement plate, it will cause errors in the settlement test of the high fill earthwork, and cause construction the inconvenience

Method used

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  • Photoelectric type high backfill earthwork settling volume testing device and mounting method thereof
  • Photoelectric type high backfill earthwork settling volume testing device and mounting method thereof
  • Photoelectric type high backfill earthwork settling volume testing device and mounting method thereof

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Embodiment Construction

[0034] see Figure 1 to Figure 12 , is a kind of optoelectronic type high-fill earthwork settlement test device of the present invention, comprising top surface settlement test device, soil subsidence test device, is characterized in that: the horizontal laser reference device 10 of described top surface settlement test device is arranged On the test bench a2 at the relatively non-displacement place, the optical guide wire displacement sensor 26 of the top surface settlement test device is placed on the test bench b3 at the top test point of the high fill earthwork 1, and the horizontal laser reference device 10 sends a horizontal laser to the optical guide wire displacement sensor 26, and when the top surface of the high fill earthwork 1 settles, the laser point emitted by the horizontal laser reference device 10 to the optical guide wire displacement sensor 26 will move upwards, and the The optical guide wire type displacement sensor 26 outputs the signal of the settlement a...

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Abstract

The invention discloses a photoelectric type high backfill earthwork settling volume testing device and a mounting method thereof. The photoelectric type high backfill earthwork settling volume testing device comprises a top surface settling testing device and a soil-in settling testing device, wherein a horizontal laser standard of the top surface settling testing device is mounted on a testing pedestal a at a relatively static position; a light transmitting filament type displacement sensor of the top surface settling testing device is mounted on a testing pedestal b at the top surface of a high backfill earthwork; the horizontal laser standard emits horizontal laser to the light transmitting filament type displacement sensor; the light transmitting filament type displacement sensor outputs a high backfill earthwork top surface settling volume signal; the soil-in settling testing device is arranged on the testing pedestal b; a circular protection pipe is arranged in a vertical drill hole of the high backfill earthwork below the testing pedestal b; an unfolding anchor head is arranged in soil at a testing point along the central line outside the pipe bottom of the protection pipe. The settling volume testing device has the characteristics that the range is large, the precision is high, no interference exists in engineering construction, the operation is convenient, the measurement data is output in real time and the like, and is a device which is capable of testing the settling volumes of the top surface of the high backfill earthwork and the inner testing point.

Description

technical field [0001] The invention relates to a device for testing the settlement of high-fill earthwork and its installation method, in particular to a photoelectric high-fill earthwork settlement test device and its installation method. Background technique [0002] At present, the method of burying settlement plates is commonly used to test the settlement of high fill earth. Due to the rolling of the connecting rod of the buried settlement plate during the earthwork construction, as well as the extension, verticality, boundary resistance, etc. of the connecting rod of the settlement plate, it will cause errors in the settlement test of the high fill earthwork, and cause construction the inconvenience. Contents of the invention [0003] Aiming at the current deficiency of using settlement plates to test the settlement of high-fill earthwork, the present invention proposes a photoelectric high-fill earthwork settlement test device and its installation method. After the...

Claims

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Application Information

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IPC IPC(8): E02D1/00G01C5/00
Inventor 朱大勇沈银斌汪哲荪
Owner HEFEI UNIV OF TECH
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