Multi-layer circuit board and manufacturing method thereof

Abstract

The invention provides a manufacturing method of a multi-layer circuit board. The method includes providing a glass circuit substrate plate comprising a first conductive circuit pattern, a glass substrate, and a second conductive circuit pattern which is provided with a plurality of first bonding pads; pressing a first pressed substrate plate, comprising a first substrate layer and a first conductive material layer, on the glass circuit substrate plate, and allowing the first substrate layer to locate between the first conductive circuit pattern and a first conductive material layer; manufacturing the first conductive material layer into a third conductive circuit pattern, and electrically connecting the third conductive circuit pattern and the first conductive circuit pattern; forming a first bonding-proof layer, provided with a plurality of first openings corresponding to first bonding pad, on the surface of the glass circuit substrate plate to expose a plurality of the first bonding pads so as to form a multi-layer circuit board. The first conductive circuit pattern and the second conductive circuit pattern are connected electrically. The invention further provides a multi-layer circuit board manufactured by the method.

Description

technical field [0001] The invention relates to the manufacturing technology of circuit boards, in particular to a multilayer circuit board with long service life and a manufacturing method thereof. Background technique [0002] With the advancement of science and technology, printed circuit boards are widely used in electronic products. For the application of the circuit board, please refer to the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans . on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] A common printed circuit board has a base layer made of an organic resin material and conductive lines formed on the base layer. However, the thermal expansion coefficient of the organic resin material is quite different from that of the chip made of silicon chip mounted on the conductive circuit, which will easily cause the conduct...

AI Technical Summary

Problems solved by technology

However, the thermal expansion coefficient of the organic resin material is quite different from that of the chip made of silicon chip mounted on the conductive circuit, which will easily cause the conductive line between the base layer and the chip to break, thereby affecting the service life of the circuit board

In addition, due to the low flatness of the base layer made of organic resin materials, it is difficult to directly form precise and ultra-fine line patterns (ie L / S less than or equal to 10 / 10um) on the base layer

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