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Heating-forming polysiloxane composition for LED (light emitting diode) components

A technology of polysiloxane and thermoforming, applied in the direction of adhesives, etc., can solve problems such as unreliable bonding, detachment of lamp cup and packaging glue, cracking, etc., and achieve the effect of excellent shrinkage

Active Publication Date: 2013-12-18
矽时代材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Silicone-based materials are usually difficult to bond well with other materials, and the thermal shrinkage rates of different material systems are not the same, so the known base or lamp cup formulations are easy to adhere to in high-temperature and high-humidity environments. Problems such as detachment and cracking between the lamp cup and the packaging glue occur due to weak bonding or inconsistent shrinkage

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] The thermoformable polysiloxane and functional material composition in the embodiment is suitable for the material formulation of the base of the LED element or the lamp cup,

[0052] 1) Alkenyl-containing network or chain polysiloxane,

[0053] Get 100 grams of 30% hydrochloric acid aqueous solution and add in the reaction flask, then add 400 grams of ethanol and 50 grams of methylphenyldimethoxysilane, 30 grams of vinyltrimethoxysilane, 306 grams of phenyltrimethoxysilane, two 60 grams of phenyldimethoxysilane, 15 grams of hexamethyldisiloxane to obtain a reaction mixture; after the reaction mixture was reacted between 40 to 90 ° C for 2 to 6 hours, after the reaction was completed, the reaction mixture was washed with water Wash until neutral, then remove the solvent under reduced pressure;

[0054] Then add concentrated sulfuric acid (H 2 SO 4 ) 5 g, after dehydration by heating under reduced pressure again, neutralize and wash with water until neutra...

Embodiment 2

[0062] Embodiment 2, detection method

[0063] (1) Red ink test (Red ink test)

[0064] Take the potted and hardened LED lamp sample and immerse it in Merck red ink, and heat it at 80°C for 24 hours. After the heating is completed, take out the potted and hardened LED lamp sample and rinse it with clean water. No red ink seeps through.

[0065] 0: Red ink penetration is not observed under an optical microscope

[0066] X: red ink penetration can be observed under an optical microscope

[0067] 2) Reflow test (reflow test) Take the LED lamp sample after potting and hardening, and reflow at 260°C for 3 minutes each time, a total of 20 times, and then observe it with an optical microscope.

[0068] 〇: Under the optical microscope, no cracking, colloid bubbling, potting glue and LED lamp cup joint surface desorption (peeling) or bubbling after hardening were observed;

[0069] X: Under the optical microscope, one of the conditions such as cracking, ...

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PUM

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Abstract

The invention relates to a polysiloxane and functional filler composition which can be hardened and formed by heating. The composition comprises (A) reticular or chain polysiloxane containing alkenyl, (B) reticular or chain polysiloxane containing hydrogen group, (C) various heat conducting, flame retardant, aging resistant and temperature resistant functional fillers, and (D) catalysts which contain alkenyl and are used for hydrogen group silylation reaction. The siloxane composition which can be hardened and formed by heating is suitable for formulas of bases or lamp cup materials of LED devices and can have excellent thermo shock resistance synchronized with the LED bases or lamp cups, resistance to cracks between the LED bases or lamp cups and the lamp cups, heat dissipation property, flame retardance and aging resistance.

Description

technical field [0001] The present invention relates to a polysiloxane composition, more specifically, to a thermoforming polysiloxane composition for LED elements. Background technique [0002] As the base or lamp cup material for packaging light emitting diode (LED, light emitting diode), it must be able to withstand the thermal shock of the temperature difference between LED on and off after being treated for 24 hours at a temperature of 85°C and a relative humidity of 85%. (thermo shock) without cracking, and there must be good adhesion between the LED frame and the metal part. [0003] Silicone-based materials are usually difficult to bond well with other materials, and the thermal shrinkage rates of different material systems are not the same, so the known base or lamp cup formulations are easy to adhere to in high-temperature and high-humidity environments. Due to insecure bonding or inconsistent shrinkage, problems such as detachment and cracking between the lam...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/06C08L83/04C08L83/05C08K3/34C08K3/22C08G77/20C08G77/18C08G77/16C08G77/12C08G77/04C09J183/07C09J183/06C09J183/05C09J183/04
Inventor 柯明新柯松
Owner 矽时代材料科技股份有限公司
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