High-heat-conductivity electric-insulation heat-conducting silica gel gasket and preparation method thereof

Abstract

The invention discloses a high-heat-conductivity electric-insulation heat-conducting silica gel gasket and a preparation method thereof. The preparation method comprises the following steps: taking the following raw materials in parts by weight: 600-1000 parts of spherical aluminum oxide, 5-15 parts of methylvinylsiloxane rubber, 30-70 parts of dimethyl silicon oil, 2-15 parts of hydrogen-containing silicon oil and 0.5-1.5 parts of catalyst; and screening the aluminum oxide particles, sintering, grinding the methylvinylsiloxane rubber and dimethyl silicon oil, stirring, vacuumizing, vulcanizing to form, and the like. The spherical aluminum oxide particles are screened and sintered to implement reasonable distribution of the aluminum oxide particles in the silica gel base and enhancement of the heat conductivity coefficient of the aluminum oxide particles; and the base material is sufficiently ground to implement sufficient fusion of the silica gel base and the aluminum oxide heat-conducting particles, thereby enhancing the heat-conducting property of the silica gel gasket. The silica gel gasket has favorable electric insulativity, and the heat conductivity coefficient is enhanced to 5.0W above.

Description

[0001] technical field [0002] The invention relates to a silica gel gasket and a preparation method thereof, in particular to a high thermal conductivity insulating and heat conduction silica gel gasket and a preparation method thereof. [0003] Background technique [0004] With the development of science and technology, electronic components are becoming more and more dense and miniaturized, which puts forward higher requirements for the stability of electronic devices. The reliability and performance of electronic products depend to a large extent Whether the heat dissipation material and heat dissipation scheme adopted are reasonable. Statistics show that for every 2°C increase in the temperature of electronic components, their reliability will decrease by 10%, and if the temperature decreases by 8°C, the life of electronic components will double. Therefore, thermal interface materials play an increasingly important role in the field of information technology. How t...

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Problems solved by technology

[0006] Heat is mainly transferred through three ways: heat conduction, heat convection and heat radiation. For heat-conducting silica gel, its main heat-conducting mechanism is through heat conduction. The heat-conducting silica gel currently used is insufficient in internal heat-conducting channels, resulting in the heat conduction of the silica gel pad. Poor performance limits its scope of application