Anisotropic electroconductive film
An anisotropic, conductive film technology, applied in the direction of conductive connection, conductive adhesive, conductive adhesive connection, etc., can solve the problems of reduced adhesion, inability to eliminate, and inability to remove moisture in the anisotropic conductive film, to achieve The effect of low on-resistance
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Embodiment 1~5
[0039] Zeolite (Zeorum A-3, manufactured by Tosoh Co., Ltd.) with an effective micropore diameter of 3 angstroms was dried under reduced pressure to evaporate water, and then it was pulverized and classified with a sieve. The average particle diameter of the obtained zeolite particles was 3.5 μm.
[0040] The anisotropic conductive films of Examples 1-5 were prepared in the same manner as in Comparative Example 1, except that the zeolite particles were added to the insulating binder in the ratio shown in Table 1.
Embodiment 6
[0042] Zeolite with an effective micropore diameter of 4 angstroms (Zeorum A-4, manufactured by Tosoh Co., Ltd.) was dried under reduced pressure to evaporate water, crushed, and classified with a sieve to prepare zeolite particles with an average particle diameter of 3.0 μm.
[0043] The anisotropic conductive film of Example 6 was prepared in the same manner as in Comparative Example 1, except that the zeolite particles were added to the insulating binder in the ratio shown in Table 1.
Embodiment 7
[0045] Zeolite with an effective micropore diameter of 5 angstroms (Zeorum A-5, manufactured by Tosoh Co., Ltd.) was dried under reduced pressure to evaporate water, crushed, and classified with a sieve to prepare zeolite particles with an average particle diameter of 3.0 μm.
[0046] The anisotropic conductive film of Example 7 was prepared in the same manner as in Comparative Example 1, except that the zeolite particles were added to the insulating binder in the ratio shown in Table 1.
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