Device, system and method for encapsulating IGBT module

Abstract

The invention provides a device, a system and a method for encapsulating an IGBT module. The device includes a first piston, a second piston, a pressing block and a gel mixing pipe, wherein the first piston is provided with a first piston rod and a first cylinder body; a first feed port and a first discharge port are formed in the first cylinder body; the first cylinder body is used for accommodating a base stock; the second piston is provided with a second piston rod and a second cylinder body; a second feed port and a second discharge port are formed in the second cylinder body; the second cylinder body is used for accommodating catalyst; the pressing block is fixed with the first piston rod and the second piston rod; driven by the pressing block, the first piston rod and the second piston rod simultaneously ascend or descend; the gel mixing pipe is provided with an inlet and an outlet that are mutually communicated; the inlet is communicated with the first discharge port and the second discharge port; and the outlet is used for outputting liquid silica gel compounds. Through the adoption of the IGBT module encapsulating device for encapsulation, the volume ratio of the base stock and the catalyst can be accurately controlled, the large batched, standardized and refined production is facilitated, the performance index of products in mass production is the consistent, the repeatability is excellent, and the quality is reliable.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to an IGBT module packaging device, system and method. Background technique [0002] With the rapid development of China's economy, high-speed rail, subway, urban rail transit, wind power, solar energy, clean energy and other fields are constantly developing. In these fields, the Insulated Gate Bipolar Transistor (hereinafter referred to as IGBT) module It is widely used in inverter devices in these fields. With the development of science and technology, the high-tech content and complex structure of the converter device has a strong specialization and tends to be more modular. The production of such large-scale modular components places extremely high demands on IGBT modules in terms of product consistency and reliability. In the production of IGBT module packaging, silicone gel and other materials have been widely used to encapsulate the internal components of the IGBT modul...

AI Technical Summary

Problems solved by technology

[0005] In the existing silicone gel potting method, it is difficult to accurately control the ratio of base material and catalyst, base material and catalyst during mixing, and the imbalance of the ratio will seriously affect the performance of the IGBT module after the encapsulation is completed

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