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Wafer processing jig

A jig and wafer technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as difficulty in ensuring stability and wafer processing quality, and achieve reduced production costs, consistent state, and Consistent results in processing quality

Inactive Publication Date: 2013-07-24
KUNSHAN THETA MICRO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to facilitate the transfer operation, the traditional Wafer wafer fixing platform generally only supports the central area of ​​the Wafer wafer, and the peripheral area is vacated so that the transfer mechanism can touch the bottom of the Wafer wafer and hold it up. This clamping Wafer wafer This method will inevitably make it difficult to guarantee the stability after clamping, and the middle area and the peripheral state are inconsistent during the Wafer wafer processing process, and it is difficult to guarantee the consistent processing quality of the entire Wafer wafer

Method used

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Embodiment Construction

[0028] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific diagrams.

[0029] refer to figure 2 , image 3 , a wafer processing fixture, including a carrying platform 1, an adsorption mechanism is arranged on the carrying platform 1, and the adsorption mechanism includes a plurality of adjusting adsorption holes 2 arranged in the middle of the carrying platform 1 and a plurality of suction holes arranged on the periphery of the carrying platform 1 A fixed adsorption hole 3. A plurality of fixed adsorption holes 3 are arranged on the carrying platform 1 in a circular shape, and a plurality of adjustable adsorption holes 2 are arranged inside the fixed adsorption holes 3 . A plurality of fixed adsorption holes 3 are connected to a fixed suction device through gas passages. The plurality of adjustable adsorption holes ...

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Abstract

The invention relates to the technical field of wafer processing, in particular to a processing jig. A wafer processing jig comprises a bearing platform, wherein an adsorption mechanism is arranged on the bearing platform. The adsorption mechanism comprises a plurality of adjustment adsorption holes formed in the middle of the bearing platform and a plurality of fixing adsorption holes formed in the periphery of the bearing platform. The fixing adsorption holes are formed in the bearing platform in a circular ring shape, and the adjustment adsorption holes are formed in inner sides of the fixing adsorption holes. The fixing adsorption holes are connected with a fixed air suction device through an air channel. The adjustment adsorption holes are connected with an adjustment air suction device through an air channel. Adsorption air pressure of the adsorption holes is adjusted through adjustment of the air suction devices. The wafer processing jig solves clamping and fixing problems of a wafer in processing and proofing stages, and guarantees that the state of a middle area and the state of the periphery of the wafer are consistent so that processing quality is uniform.

Description

[0001] technical field [0002] The invention relates to the technical field of wafer processing, in particular to a processing jig. [0003] Background technique [0004] With the rapid development of semiconductor and chip technology, there are more and more Wafer wafer products of various specifications, and product diversification will inevitably put forward higher requirements for the manufacturing process and quality control of Wafer wafer products. Wafer wafer products generally have specifications ranging from 4 inches, 6 inches, 8 inches, 12 inches or even larger. The overall shape is circular and flat, and the thickness is generally less than 3mm. Its material is a brittle material, and it is very easy to cause the Wafer wafer to be broken and scrapped when it is clamped and fixed during the Wafer wafer transfer and processing. [0005] The traditional wafer processing tool is a high-speed rotary cutting of a diamond grinding wheel. With the increase of device in...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/683
Inventor 魏志凌宁军蔡猛
Owner KUNSHAN THETA MICRO
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