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Reductant composition and preparation method thereof, and welding method

A welding method and composition technology, applied in the field of reducing agent composition and its preparation, can solve the problems of poor scum treatment effect, achieve considerable economic benefits, increase the level of bonding or adhesion, and promote the effect of bonding or adhesion quality

Inactive Publication Date: 2013-07-24
SHENZHEN KUNQI XINHUA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] In order to overcome the problem of poor treatment effect of reducing agent composition on scum in the prior art, the present invention provides a reducing agent composition, which has excellent treatment effect on scum, and is convenient and safe to use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0080] The preparation method of the above-mentioned reducing agent composition is as described above, and will not be repeated here.

[0081] In order to be more economical and achieve better economic results, in actual use, the welding method disclosed by the present invention further includes:

[0082]A metal baffle is arranged in the solder pool, and the metal baffle is located under the surface of the molten solder. Further, there are 3-5 metal baffles. Specifically set at 3-5cm below the surface of the molten solder.

[0083] The above-mentioned structure can limit the flowing part of the molten metal in a small area, so that most of the liquid surface is at rest, but the flow below the liquid surface can be fully circulated, without affecting the original operation mode of the whole process. At the same time, the flow of the molten solder liquid surface is small, which reduces the formation of oxides, and can also reduce the usage of the reducing agent composition to ...

Embodiment 1

[0097] This example is used to illustrate the reducing agent composition disclosed in the present invention, its preparation method and welding method.

[0098] Add 27 parts by weight of phytic acid and 35 parts by weight of nonylphenol polyoxyethylene ether to 3 parts by weight of ammonium metaphosphate at 90°C, and then stir at 70°C for 30 minutes. Add 35 parts by weight of nonylphenol polyoxyethylene ether and stir for 30 minutes. A reducing agent composition S1 is obtained.

[0099] In the soldering pool of the wave soldering machine, melt tin-silver-copper alloy solder (96.5% Sn, 3% Ag, 0.5% Cu) at 275°C, and then add reducing agent composition S1 to form on the surface of the molten solder with the above composition floating layer, began to wave solder the printed circuit board.

[0100] Collect the resulting scum A1.

Embodiment 2

[0102] This example is used to illustrate the reducing agent composition disclosed in the present invention, its preparation method and welding method.

[0103] Add 3 parts by weight of ammonium dihydrogen phosphate to 3 parts by weight of ammonium metaphosphate at 90°C, then add 24 parts by weight of phytic acid and 50 parts by weight of nonylphenol polyoxyethylene ether, and then stir at 70°C for 40 minutes. Add 20 parts by weight of nonylphenol polyoxyethylene ether and stir for 40 minutes. A reducing agent composition S2 is obtained.

[0104] In the soldering pool of the wave soldering machine, melt the tin-silver-copper alloy solder (96.5% Sn, 3% Ag, 0.5% Cu) at 275°C, then add the reducing agent composition S2 to form on the surface of the molten solder with the above composition floating layer, began to wave solder the printed circuit board.

[0105] Collect the resulting scum A2.

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PUM

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Abstract

The invention provides a reductant composition which comprises a nonionic surfactant, an antioxidant and ammonium metaphosphate. Meanwhile, the invention further discloses a preparation method of the reductant composition and a welding method. The reductant composition provided by the invention used in wave-soldering is excellent in scum treatment effect, and convenient and safe to use.

Description

technical field [0001] The invention relates to a reducing agent composition and a preparation method thereof, in particular to a reducing agent composition for through-hole welding and a preparation method thereof. Background technique [0002] In industrial production, it often involves the process of melting a metal or alloy to combine or adhere to another metal. Since most metals will be oxidized in contact with oxygen, such as tin slag (SnO and SnO) produced in a static tin furnace or a dynamic wave furnace 2 ) is one of the most common examples of metal oxidation in industry. In a high-temperature environment, especially in a molten state, the oxidation of the metal (or alloy) will be more severe, and a layer of oxide will soon be formed, and the more it gathers. In the process of adhesion and bonding of molten metal and other metals, the molten metal must be continuously flowed and circulated, which will intensify the oxidation rate on the one hand, and on the other...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K1/00
Inventor 严永农
Owner SHENZHEN KUNQI XINHUA
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