Urea-formaldehyde foam plastic insulation board and preparation method thereof

Abstract

The invention relates to a urea-formaldehyde foam plastic insulation board, which is prepared from the following components in the ratio of parts by weight of urea resin to sodium dodecyl sulfate to phosphoric acid urea to mica powder to expanded perlite to water being (600-700) to (5-8) to (8-10) to (3-6) to (50-80) to (50-80) to (200-300). The solid substance in the product disclosed by the invention is even in distribution, and small in product density; light foam can be produced; the mica powder is mixed with the expanded perlite according to the graduation as a product aggregate, so as to form a stable volume structure; the shrinkage of the size of the product is reduced; meanwhile, the distribution of inner stress of the product is improved; chapping and bending are avoided; and the problems of bending, chapping and the like in the drying process are also solved. The insulation board disclosed by the invention has the characteristics of low heat-conducting coefficient, good insulating property, and good flame retardant property; and the burning grade is A2 level.

Description

technical field [0001] The invention relates to a thermal insulation board and a preparation method thereof, in particular to a urea-formaldehyde foam plastic insulation board and a preparation method thereof. Background technique [0002] The publication date is February 22, 2006. The Chinese invention patent urea-formaldehyde foam insulation board and its preparation method with publication number CN1736936A discloses a urea-formaldehyde foam insulation board. The urea-formaldehyde foam insulation board has excellent flame retardancy. Light weight, heat preservation, heat insulation, and easy construction, etc., but in practical applications, the urea-formaldehyde foam insulation board has a large shrinkage rate during the drying and water loss process, and the shrinkage rate is greater than 6%, while the national standard for insulation products requires less than 3%. At the same time, the urea-formaldehyde foamed plastic insulation board has problems such as warping and ...

AI Technical Summary

Problems solved by technology

[0002] The publication date is February 22, 2006. The Chinese invention patent urea-formaldehyde foam insulation board and its preparation method with publication number CN1736936A discloses a urea-formaldehyde foam insulation board. The urea-formaldehyde foam insulation board has excellent flame retardancy. Light weight, heat preservation, heat insulation, and easy construction, etc., but in practical applications, the urea-formaldehyde foam insulation board has a large shrinkage rate during the drying and water loss process, and the shrinkage rate is greater than 6%, while the national standard for insulation products requires less than 3%. At the same time, the urea-formaldehyde foam insulation board has problems such as warping and cracking during use.

The announcement date was August 18, 2010. The Chinese invention patent urea-formaldehyde resin foam thermal insulation composite powder with the announcement number CN101029164B and the composite board synthesized by die-casting the powder and the method disclosed a composite board. Warping, cracking and other problems, but because it is a die-casting product, the density is greater than 150KG / m 3 , high thermal conductivity, poor thermal insulation performance

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