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Method for manufacturing of circuit board

A technology of circuit boards and substrates, which is applied in the direction of secondary processing of circuits, printed circuits, and assembly of printed circuits with electrical components, and can solve problems such as increased volume of organic emissions, increased equipment footprint, and environmental problems

Inactive Publication Date: 2013-07-03
SAMSUNG ELECTRO MECHANICS CO LTD
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Problems solved by technology

[0013] However, since this traditional process is implemented by soaking the substrate in the OSP solution, the OSP solution may be easily contaminated and requires filters and pumps for controlling the OSP solution and additional devices for replenishing the OSP solution, which inevitably increases the equipment footprint
[0014] Additionally, OSP solutions should be filtered to remove impurities, so organic discharge volumes may increase, unnecessarily increasing disposal costs and causing environmental problems

Method used

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Embodiment Construction

[0030] The features and advantages of the present invention will be more clearly understood from the following detailed description and embodiments. Throughout the drawings, the same reference numerals are used to designate the same or similar elements. Furthermore, even if known arts are related to the present invention, when they would make the characteristics and description of the present invention unclear, their descriptions are considered unnecessary and may be omitted. In the description, the terms 'first', 'second', etc. are used to distinguish one element from another element, and the elements are not defined by the above terms.

[0031] In addition, the terms and words used in this specification and claims should not be construed as limited to the ordinary meanings and dictionary definitions, but should be based on the inventor's ability to properly define the concepts implied by the terms with the best The rules according to describing the method known to him or he...

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Abstract

A manufacturing method of a circuit substrate is provided to form a surface processing layer by coating with an OSP(Organic Solderability Preservative) liquid and reducing an organic exhausting volume. A base substrate(100) having a connection pad(101) is prepared. A mask(200) having an opening part(205) on the base substrate is arranged. A surface treatment liquid(300) is charged in the opening part. The surface processing layer is formed on the connection pad with a step of heating. The mask is removed.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2011-0144879, filed Dec. 28, 2011, entitled "Method for manufacturing of circuit board," the entire contents of which are incorporated herein by reference. technical field [0003] The invention relates to a method of manufacturing a circuit board. Background technique [0004] With the increasing trend to reduce the size and thickness of electronic products and components, intensive research is being conducted to achieve wafer-level packaging and thinning of printed circuit boards (PCBs). [0005] Meanwhile, in the case of connection pad surface treatment, inexpensive processing that does not use conventionally used gold (Au), silver (Ag) and tin (Sn) is examined. [0006] The surface treatment of the packaged product has the function of protecting the surface of the connection pads of the circuit board from oxidation and promoting the bonding of...

Claims

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Application Information

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IPC IPC(8): H05K3/40
CPCH01L2224/13H01L23/48H05K3/28H05K3/34
Inventor 李彰培金镇求权宁度
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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