Adhesive-free cutting method for silicon dioxide evaporation material

Abstract

The invention discloses an adhesive-free cutting method for a silicon dioxide evaporation material. The adhesive-free cutting method for the silicon dioxide evaporation material comprises the following steps of: firstly, laying down silicon dioxide rods which are equal in length and diameter at assigned positions on a guide platform of an adhesive-free cutting machine without any adhesives; then, rolling rubber roll clamping rods on the guide table to deliver the silicon dioxide rods to a cutting width; then, rising a cutting table to be abutted with the silicon dioxide rods; then, enabling a rod pressing plate of a rod pressing device to extend forwards to be close to positions of the silicon dioxide rods, arranging a magnetic attraction device below the cutting table, and pressing the rods by magnetic forces formed by attraction of the magnetic attraction device and the rod pressing plate; then, rotating cutting blades and doing a horizontal motion along the direction which is vertical to axis of each silicon dioxide rod to perform cutting; resetting the rod pressing plate and the cutting blades after the cutting process is ended; and finally, enabling the cutting table to fall, and collecting cutting products: silicon dioxide particles. As the adhesives or auxiliary materials are not needed, the adhesive-free cutting method for the silicon dioxide evaporation material is energy-saving and labor-saving and is in favor of environmental protection. The adhesive-free cutting method for the silicon dioxide evaporation material can be used for preparing silicon dioxide evaporation material instead of a traditional adhesion method.

Description

technical field [0001] The invention relates to a cutting method of silicon dioxide evaporation material, in particular to a glue-free cutting method of silicon dioxide evaporation material. Background technique [0002] Evaporation coating materials are the starting materials for preparing various optical films, and silicon dioxide is one of the most important and commonly used starting evaporation materials. Put the small particle silicon dioxide material in the evaporation crucible of the vacuum chamber, and use the electron beam evaporation technology to form a silicon dioxide single-layer film or film stack or film system to form optical filter films with various functions. As described in patent ZL200710025480.7, there are two types of starting particles of silica evaporation materials commonly used: particles with irregular shape and size and particles with uniform shape and size. However, the traditional preparation methods of these two kinds of particles all adopt ...

AI Technical Summary

Problems solved by technology

This preparation method requires a special material board, a special adhesive and a special rubber board, coating and bonding, drying, cutting, shoveling the silica particles from the rubber board, and subsequent degumming and cleaning. The process is complicated; and the waste and exhaust gas generated during the application, drying, degumming and cleaning of the adhesive will pollute the environment

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