Mainboard used for radiator and machining method thereof

A processing method and radiator technology, which are applied in the field of improving the motherboard for radiators and its processing, can solve the problems of low qualification rate of one-time welding between the motherboard and the tube, affecting the reliability, stability and vibration resistance of the product, and cracking at the connection between the motherboard and the tube and other problems, to achieve the effect of shortening the production cycle, improving the welding quality, and increasing the welding area

Inactive Publication Date: 2013-06-26
ZHEJIANG YINLUN MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. The flange of the slot hole is turned inward, which is the same as the bending direction of the main board, but opposite to the assembly direction of the cooling pipe, which is not conducive to the introduction of the cooling pipe
[0004] 2. The thickness of the slot flange is the same as that of the main board, but the height of the slot flange is limited, so the contact area with the cooling pipe is small, resulting in a small welding surface area, and the one-time welding pass rate of the main board and the pipe is not high, which affects production efficiency, and increase the manufacturing cost of the product
[0005] 3. There is no transitional shape between the main board and the outer surface of the tube, which will cause cracks at the connection between the main board and the tube during use, which will affect the reliability, stability and vibration resistance of the product

Method used

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  • Mainboard used for radiator and machining method thereof
  • Mainboard used for radiator and machining method thereof
  • Mainboard used for radiator and machining method thereof

Examples

Experimental program
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Embodiment Construction

[0027] refer to figure 1 , figure 2 and image 3 , the structure of the mainboard for the existing heat sink. Its defects have been described above, and will not be repeated here.

[0028] refer to Figure 4 and Figure 5 , a mainboard for a heat sink of the present invention, the mainboard body is in a rectangular structure, and the mainboard material is an aluminum composite material. There are a plurality of rectangular slots 11 on it, each of the slots 11 has a flange 25 formed by extrusion, the direction of the flange 25 is opposite to the bending direction of the main board, and the thickness of the flange 25 is close to 1% of the thickness of the main board. / 2.

[0029] refer to Figure 5 and Figure 6 , the present invention makes full use of the plastic deformation of the main board material to increase the flange height 10, which is more than doubled than that of the prior art, and then the welding area of ​​the cooling pipe 22 and the main board is more th...

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PUM

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Abstract

The invention discloses an improved mainboard used for a radiator and a machining method thereof. A plurality of groove holes are formed in a board body of the mainboard. The mainboard is characterized in that each groove hole is provided with a turnup which is formed by squeezing, wherein the direction of the turnups is opposite to the bending direction of the mainboard, and the thickness of the turnups is smaller than or equal to one third of the thickness of the mainboard. The mainboard has the advantages that a welding area is large, welding quality is high; in the manufacture process of the turnups, protruding groove ribs are enabled to be cool-worked and hardened due to the powerful effect, roughness of the inner walls of the groove holes can be improved, so that assembling accuracy and the integral strength of the mainboard are improved; the turnups of the groove holes and turnups of the mainboard are in the opposite directions, effective transition is formed between the outwardly-protruding turnups of the mainboard and a pipe, reliability, stability and vibration-proof intensity of the radiator are improved, and accordingly the integral quality of the radiator is improved.

Description

technical field [0001] The invention relates to the field of radiators, in particular to an improved motherboard for radiators and a processing method thereof. Through continuous improvement, the purpose is to improve the first-time brazing pass rate and reliability of the radiator. Background technique [0002] Radiators are widely used in various fields such as automobiles, engineering machinery, aerospace and household appliances. The main board for radiators is an important part of radiators. The technology of its groove structure directly affects the production process of radiators (such as gas shielded welding, or other welding methods such as vacuum brazing), and has an important relationship with reducing costs. The main board usually has a rectangular plate structure, and a plurality of assembly slots are opened on it for inserting cooling pipes. The assembly slots are arranged in rows, and the number of rows is single or multiple. The hole opening process of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28F9/00B21D35/00
Inventor 杨联民陈伟刘武军周益民齐明武陈陆英朱崇健许光新沈春明范正银
Owner ZHEJIANG YINLUN MACHINERY
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