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Preparation method of high-infrared-emittance heat dissipation coating

A heat-dissipating coating and infrared radiation technology, applied in the coating, metal material coating process, molten spraying, etc., can solve the problems of hidden safety hazards, poor heat dissipation, short service life of products, etc., to improve reliability, structure Compact, lightweight effect

Inactive Publication Date: 2013-06-26
SHENYANG XINJIN POWDER ENG
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AI Technical Summary

Problems solved by technology

This method mainly solves the technical problems of short service life of products and potential safety hazards caused by temperature rise due to poor heat dissipation of existing electronic devices

Method used

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Examples

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Embodiment Construction

[0014] Below in conjunction with specific embodiment, further illustrate the present invention. It should be understood that these embodiments are only used to illustrate the present invention and not to limit the scope of the present invention. In addition, it should be understood that after reading the teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.

[0015] In Examples 1-5, the base material is aluminum alloy, on which a 100 μm thick high-emissivity infrared radiation heat dissipation coating is prepared. Among them, the composition of the high infrared radiation heat dissipation coating powder is listed in Table 1. The purity of the selected raw materials is required to be analytically pure, the particle size is required to be uniform and submicron, and the purity of all raw materia...

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Abstract

The invention relates to a preparation method of a high-infrared-emittance heat dissipation coating, which mainly solves the technical problem of short product service life due to poor heat dissipation and the technical problem of potential safety hazard due to temperature increase in the existing electronic device. The main component of the heat dissipation coating is Mn-Cr-Ti-Cu complex oxides, and the oxide powder can be subjected to plasma spray on a matrix surface to prepare the high-infrared-emittance coating. The coating powder is composed of one or more of the following oxides: 5-47% of MnO2, 37-70% of Cr2O3, 5-12% of CuO and 11-25% of TiO2. The prepared high-infrared-emittance heat dissipation coating material has the advantages of high infrared emittance, favorable heat dissipation and high bonding strength with the matrix, can effectively lower the temperature in electronic instruments and enhance the reliability of electronic equipment, and is applicable to the fields of electronic measuring instruments, computer room equipment, measurement and control systems, aircrafts, arms of precision and the like. The coating material also has the advantages of compact structure, light weight, high bonding property and high shock and vibration resistance; and the technique is practical and suitable for industrial production.

Description

technical field [0001] The invention relates to a preparation method of a heat dissipation coating, in particular to a preparation method of a high infrared radiation heat dissipation coating with good bonding performance with a substrate, and belongs to the technical field of preparation and application of special coatings. Background technique [0002] With the continuous development of science and technology, the emergence and widespread popularization of electronic equipment, computers and household appliances, the high integration and large capacity of electronic devices have increasingly seriously affected the safe use of circuits. Especially with the prolongation of the working time, the temperature rises due to the heating of the device. The temperature rise will easily cause the working temperature of the electronic device to rise, and the accuracy of the precision control electronic device will decrease or become unstable, which will also affect the precise control ...

Claims

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Application Information

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IPC IPC(8): C23C4/10C23C4/12C23C4/08C23C4/11C23C4/134
Inventor 杨殿来韩绍娟许壮志薛健张明时卓
Owner SHENYANG XINJIN POWDER ENG
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