Epoxy modified organic silicon resin adhesive and preparation method thereof

A resin adhesive and epoxy modification technology, applied in epoxy resin coatings, coatings, polyurea/polyurethane coatings, etc., can solve the problems of poor adhesion, inability to meet the needs of use, and unreasonable formula ratios. , to achieve the effect of good adhesion, good adhesion and simple process

Inactive Publication Date: 2015-03-11
GUANGDONG XINZHAN NEW CHEM MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In short, an adhesive is a substance that can bind adherends together through bonding; traditional adhesives have poor adhesion due to unreasonable formula ratios and cannot meet the needs of use.

Method used

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  • Epoxy modified organic silicon resin adhesive and preparation method thereof
  • Epoxy modified organic silicon resin adhesive and preparation method thereof
  • Epoxy modified organic silicon resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The epoxy modified silicone resin adhesive of the present invention consists of the following components in parts by weight:

[0031]

[0032]

[0033] Preparation:

[0034] A, preparation of polyurethane modified epoxy resin

[0035] Heat 15 parts by weight of polyester polyol to 100°C for reflux dehydration, cool down to 40°C, add 4 parts by weight of diphenylmethane diisocyanate, heat to 65°C, react for 1 hour, cool to room temperature, add 0.5 parts by weight of 2 , 3 butanediol and 1 weight part of trimethylolpropane were stirred uniformly to obtain a polyurethane prepolymer, and 100 parts by weight of epoxy resin was added to the polyurethane prepolymer to react for 1 hour to obtain a polyurethane modified epoxy resin;

[0036] B. Preparation of epoxy modified silicone resin:

[0037] In the reaction kettle, add 80 parts by weight of hydroxyl-terminated polydimethylsiloxane, 30 parts by weight of bisphenol A type epoxy resin and 3 parts by weight of dibuty...

Embodiment 2

[0043] The epoxy modified silicone resin adhesive of the present invention consists of the following components in parts by weight:

[0044]

[0045] Preparation:

[0046] A, preparation of polyurethane modified epoxy resin

[0047] Heat 20 parts by weight of polyester polyol to 120°C for reflux dehydration, cool down to 60°C, add 7 parts by weight of diphenylmethane diisocyanate, heat to 80°C, react for 3 hours, cool to room temperature, add 2 parts by weight of 2 , 3 butanediol and 3 parts by weight of trimethylolpropane were stirred uniformly to obtain a polyurethane prepolymer, and 100 parts by weight of epoxy resin was added to the polyurethane prepolymer to react for 3 hours to obtain a polyurethane modified epoxy resin;

[0048] B. Preparation of epoxy modified silicone resin:

[0049] In the reaction kettle, add 80 parts by weight of hydroxyl-terminated polydimethylsiloxane, 30 parts by weight of bisphenol A type epoxy resin and 3 parts by weight of dibutyltin dil...

Embodiment 3

[0055] The epoxy modified silicone resin adhesive of the present invention consists of the following components in parts by weight:

[0056]

[0057] Preparation:

[0058] A, preparation of polyurethane modified epoxy resin

[0059] Heat 16 parts by weight of polyester polyol to 110°C for reflux dehydration, cool down to 50°C, add 5 parts by weight of diphenylmethane diisocyanate, heat to 70°C, react for 2 hours, cool to room temperature, add 1 part by weight of 2 , 3 butanediol and 2 parts by weight of trimethylolpropane were stirred uniformly to obtain a polyurethane prepolymer, and 100 parts by weight of epoxy resin was added to the polyurethane prepolymer to react for 2 hours to obtain a polyurethane modified epoxy resin;

[0060] B. Preparation of epoxy modified silicone resin:

[0061] In the reaction kettle, add 80 parts by weight of hydroxyl-terminated polydimethylsiloxane, 30 parts by weight of bisphenol A type epoxy resin and 3 parts by weight of dibutyltin dilaur...

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PUM

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Abstract

The invention discloses an epoxy modified organic silicon resin adhesive and a preparation method thereof. The adhesive is prepared from the following components of 10-30 parts of polyurethane modified epoxy resin, 20-70 parts of epoxy modified organic silicon resin, 20-60 parts of fluorene-based epoxy resin, 10-40 parts of carboxyl-polybutadiene acrylonitrile liquid rubber, 10-60 parts of curing agent, 1-8 parts of thixotropic agent, 0.5-3 parts of compound accelerator and 2-6 parts of coupling agent. The preparation method comprises the steps of weighing each component according to the ratio, evenly mixing the polyurethane modified epoxy resin, the epoxy modified organic silicon resin, the fluorene-based epoxy resin and the carboxyl-polybutadiene acrylonitrile liquid rubber under agitation at 50-70 DEG C; adding the curing agent, the thixotropic agent and the coupling agent and heating to 70-90 DEG C; evenly agitating, and cooling to room temperature after vacuum defoaming; and adding the compound accelerator under agitation at 40-50 DEG C until evenly mixing. The modified epoxy resin adhesive is good in adhesion and simple in process, and has good adhesion on materials such as metal, glass, and plastic ceramic.

Description

technical field [0001] The invention relates to an epoxy-modified silicone resin adhesive; the invention also relates to a method for preparing the epoxy-modified silicone resin adhesive. Background technique [0002] Adhesive refers to a kind of natural or synthetic, organic or inorganic substances that can connect two or more parts or materials together through the adhesion and cohesion of the interface, collectively referred to as glue. Adhesives, also known as adhesives, are customarily referred to as glue. In short, an adhesive is a substance that can bind adherends together through bonding; traditional adhesives have poor adhesion due to unreasonable formula ratios and cannot meet the needs of use. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, and provide an epoxy-modified silicone resin adhesive with reasonable components and proportions and good bonding performance. [0004] Another objec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D175/06C09D183/10C09D163/00C08G18/58C08G77/42C08G59/06C08G59/50
Inventor 黄活阳
Owner GUANGDONG XINZHAN NEW CHEM MATERIAL
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