Technology method of void-free butt welding of large-area flat plate

Abstract

The invention relates to a technology method of void-free butt welding of a large-area flat plate. The technology method of the void-free butt welding of the large-area flat plate comprises the following steps: a, adopting a substep printing technology, namely firstly printing low-melting-point soldering paste on the central area of a to-be-welded end face, and then printing high-melting-point soldering paste on the peripheral area of the to-be-welded end face; b, using a fixture to fix a to-be-welded device which is provided with soldering paste in a printing mode; and c, adopting a three-section type heating method to carry out reflow soldering. The technology method of the void-free butt welding of the large-area flat plate can improve quality of large-area butt welding of electronic devices.

Description

technical field [0001] The invention relates to the fields of electronic device welding and surface packaging materials, in particular to a process method for butt welding of large-area flat plates without gaps. Background technique [0002] With the development of electronic products, more and more electronic devices require the performance of heat dissipation, signal shielding, or signal transmission and reception. Most of these electronic devices require butt welding of large-area pads (or welding surfaces). At present, prefabricated solder sheets are usually used, or solder paste is printed with rectangular openings, and then reflowed to achieve butt soldering. However, during reflow soldering, the volatiles in the flux often cannot overflow in time, which will cause defects such as residual pores in the weld, resulting in uneven solder filling, inconsistent heat dissipation and shielding performance at different positions, and product quality cannot meet the requirement...

AI Technical Summary

Problems solved by technology

However, due to reflow soldering, the volatiles in the flux often cannot overflow in time, which will cause defects such as residual pores in the weld, resulting in uneven solder filling, inconsistent heat dissipation and shielding performance at different positions, and product quality cannot meet the requirements.