Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacture technology of inlaying injection circuit in mold

A technology of inlaid injection molding and manufacturing technology, applied in the direction of coating, etc., can solve the problems of small operation possibility, pollution, high scrap rate, etc., and achieve the effect of reducing production cost and simplifying the process

Active Publication Date: 2013-06-19
上海志承新材料有限公司 +1
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method of bonding has the problem of unevenness. There are local gaps in the film and plastic bonding parts, which are easy to oxidize and the small molecules of the adhesive solvent are easy to volatilize in the air and cause pollution. It is easy to degumming after a long time.
In the production process, there are problems such as large labor costs, low production efficiency, high scrap rate, and high production costs.
Furthermore, the limitation of the internal space of a large number of micro-electrical appliances makes it very unlikely that the film printed circuit will be bonded to the plastic main part with double-sided adhesive tape.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacture technology of inlaying injection circuit in mold
  • Manufacture technology of inlaying injection circuit in mold
  • Manufacture technology of inlaying injection circuit in mold

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention will be further elaborated below in conjunction with specific illustrations.

[0030] refer to figure 1 , the manufacturing process of in-mold inserting injection molding circuit, comprising the following steps:

[0031] The first step is the manufacturing process of the printed circuit film, including: using nano-scale silver paste ink to screen-print on the matching 0.05-0.25 film to form a printed circuit, and a layer can be printed on the printed circuit according to different purposes. Insulating ink, forming an insulating layer. Hot-melt adhesive can also be printed on the insulating layer to form a layer of adhesive, which is used to bond with molten plastic under the high temperature conditions of injection molding.

[0032] The second step is the shaping process of the printed circuit film, including: according to ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of circuit printing technology, in particular to manufacture technology of a printing circuit. The manufacture technology of inlaying an injection circuit in a mold comprises the manufacture technology of a printing circuit film and further comprises film molding integration technology. The printing circuit film is embedded into a mold cavity of an injection mold and formed together with plastics in a molten state in an injection mode, and an integration injection part is manufactured. By the adoption of the technical scheme, the film and plastic gluing technology is once completed in an injection mold. The printed circuit film and a main molding part body are firmly integrated, and the manufacture technology of inlaying the injection circuit in the mold has the advantages that the printed circuit film does not desquamate and not to be oxidated without escaping of small solvent molecules and the like.

Description

technical field [0001] The invention relates to the technical field of circuit printing, in particular to a manufacturing process of a printed circuit. Background technique [0002] At present, the thin-film printed circuits used in the electronics industry are generally bonded with double-sided adhesive tape and plastic main parts. This method of bonding has the problem of unevenness. There are local gaps in the film and plastic bonding parts, which are easy to oxidize and the small molecules of the adhesive solvent are easy to volatilize in the air to cause pollution, and it is easy to degumming after a long time. In the production process, there are problems such as large labor cost, low production efficiency, high reject rate, and high production cost. Furthermore, the limitations of the internal space of a large number of micro-electrical appliances make it very unlikely that the thin-film printed circuit will be bonded to the plastic main part with double-sided adhesi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/14B29C45/17
Inventor 徐国祥
Owner 上海志承新材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com