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Modified phenolic aldehyde insulation foamed material preparation method

A technology of phenolic thermal insulation and foam materials, applied in the field of foam materials, can solve the problems of poor toughness and easy pulverization of phenolic foam, and achieve the effects of poor toughness, moderate foam density and cost saving

Inactive Publication Date: 2013-05-15
东北大学秦皇岛分校
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a preparation method of modified phenolic foam insulation, which is characterized in that organic-inorganic nanocomposites are used as modifiers to solve the problem of phenolic foam without affecting the flame retardancy of phenolic foam. The disadvantages of poor toughness and easy pulverization; the preparation process of modified phenolic thermal insulation foam material includes the following steps:

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0027] 1) Add 2 parts of silica sol, 15 parts of acrylic acid, and 50 parts of water in sequence in the reaction kettle. 55℃ React under the low pressure condition of 0.6Mpa for 33 minutes to prepare an organic-inorganic nanocomposite material with a viscosity of 5000mPa.S as component A.

[0028] 2) Weigh 100 parts of phenolic resin in a container, add 5 parts of Tween 20 and 10 parts of n-pentane in turn, mix and stir for 30-40 seconds to make it evenly dispersed, and obtain component B.

[0029] 3) Add 2 parts of component A to component B, then add 18 parts of acidic curing agent (hydrochloric acid or phosphoric acid), stir mechanically for 10 seconds, pour into the mold, foam at 70°C for 30 minutes, and mature for two Hours, get phenolic foam insulation.

[0030] The surface of the obtained phenolic foam is not pulverized, the foam is dense and uniform, and the foam density is 53.04kg / m 3 , Compressive strength 0.133MPa. The compressive strength is 41.86% higher than t...

example 2

[0032] 1) Add 4 parts of silica sol, 18 parts of polyacrylic acid, and 50 parts of water in sequence in the reaction kettle. 65℃ React for 35 minutes under a low pressure condition of 0.6Mpa to prepare an organic-inorganic nanocomposite material with a viscosity of 6000mPa.S as component A.

[0033] 2) Weigh 100 parts of phenolic resin in a container, add 5 parts of Tween 80 and 10 parts of isopentane in turn, mix and stir for 30-40 seconds to make it evenly dispersed, and obtain component B.

[0034] 3) Add 8 parts of component A to component B, then add 8 parts of acidic curing agent (equal compound of benzenesulfonic acid and xylenesulfonic acid), stir mechanically for 10s, pour into the mold, and carry out at 70°C Foaming for 30 minutes and aging for 2 hours to obtain a phenolic foam insulation material.

[0035] The apparent density of the obtained phenolic foam board is 59.37kg / m 3 , increased by 58%; the compressive strength was 0.143MPa, increased by 66%.

example 3

[0037] 1) Add 6 parts of silica sol, 15 parts of polyacrylic acid, and 50 parts of water in sequence in the reaction kettle, 75℃ React under the low pressure condition of 0.6Mpa for 38 minutes to prepare an organic-inorganic nanocomposite material with a viscosity of 8000mPa.S as component A.

[0038] 2) Weigh 100 parts of phenolic resin in a container, add 5 parts of Tween 60 and 12 parts of hydrofluorocarbon in sequence, mix and stir for 30-40s to make it evenly dispersed, and obtain component B.

[0039] 3) Add 8 parts of component A to component B, then add 10 parts of acid curing agent, stir mechanically for 10 seconds, pour into the mold, foam at 70°C for 30 minutes, and mature for two hours to obtain phenolic formaldehyde Foam insulation.

[0040] The apparent density of the obtained phenolic foam board was 50.96kg / m3, an increase of 36.29%; the compressive strength was 0.143MPa, an increase of 66%.

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Abstract

The invention discloses a modified phenolic aldehyde insulation foamed material preparation method, which belongs to the foamed material field. According to the invention, an organic-inorganic nanocomposite is taken as a modifier, the modifier, a surfactant, a foaming agent and an acidic curing agent are added in phenolic resin, the resulting mixture is dumped in a die, mechanically stirred, and foamed at certain temperature to obtain the modified phenolic aldehyde insulation foamed material. According to the invention, agglomeration problem of the inorganic nano modifier can be effectively overcome, the compatibility of the inorganic nano particle and organic resin can be increased, the mechanical strength of phenolic aldehyde cystosepiment is effectively enhanced, and the technical problems of high toughness and efflorescence degree of the traditional phenolic aldehyde cystosepiment can be solved, the density of prepared phenolic aldehyde foamed material is moderate, and the phenolic aldehyde foamed material has characteristics of good flame resistance and toughness, and low efflorescence degree.

Description

technical field [0001] The invention belongs to the field of foam materials, and relates to a preparation method of a modified phenolic thermal insulation foam material. Background technique [0002] In recent years, high-rise building fire incidents have occurred frequently, which has aroused widespread concern in the society. The reason is that most buildings use polyurethane foam and polystyrene foam as thermal insulation materials. These two types of foam are flammable and will produce toxic gas and thick smoke when burned, causing huge casualties in the event of a fire. Therefore, it is of great significance to develop new thermal insulation materials. [0003] As a new generation of thermal insulation and fireproof materials, phenolic foam has the following excellent properties compared with traditional polystyrene, polyurethane and other foam thermal insulation materials: First, it has good fire safety. Generally, it is 35-40. There is no open flame when burning, se...

Claims

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Application Information

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IPC IPC(8): C08L61/06C08L33/02C08K3/36C08K5/09C08J9/14
Inventor 王海旺张宇艳宋立辉杜月文李航宇董果果路修远
Owner 东北大学秦皇岛分校
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