Silicon wafer automatic feeding and discharging device for plasma enhanced chemical vapor deposition (PECVD) device

Abstract

The invention relates to a silicon wafer automatic feeding and discharging device for a plasma enhanced chemical vapor deposition (PECVD) device. A mechanical arm is installed on a rack in a rotating mode, and an adhesive disc is installed on the mechanical arm. A first silicon box transmission mechanism, a first lifting platform mechanism, a guide mechanism, a first out slice transporting mechanism, a first musical storing mechanism, a first transporting mechanism, a first trolley positioning mechanism, a first graphite boat positioning mechanism and a first transporting trolley are installed on the rack which is arranged at the outer side of the mechanical arm. A second silicon box transmission mechanism, a second lifting platform mechanism, an out slice transporting mechanism, a second out slice transporting mechanism, a second musical storing mechanism, a second transporting mechanism, a second trolley positioning mechanism, a second graphite boat positioning mechanism and a second transporting trolley are installed at the inner side of the rack. The silicon wafer automatic feeding and discharging device for the PECVD device has the advantages of greatly improving production efficiency, reducing labor intensity of workers, preventing the problem of high silicon damage rate caused by manual feeding and discharging from happening and decreasing manufacturing cost.

Description

technical field [0001] The invention relates to the field of solar silicon wafer processing automation equipment, in particular to an automatic silicon wafer loading and unloading device for PECVD equipment. Background technique [0002] In the existing silicon wafer anti-reflection film preparation process, the silicon wafers in the carrier box that have not been treated by PECVD need to be loaded into the graphite boat, and the silicon wafers in the graphite boat that have been treated by PECVD are loaded into the carrier box. At present, the above-mentioned transfer of silicon wafers needs to be done manually. The disadvantage is that manual handling can easily cause silicon wafers to break and increase production costs. At the same time, manual operations have low production efficiency and high labor intensity. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, and provide a silicon wafer automatic ...

AI Technical Summary

Problems solved by technology

At present, the above-mentioned transfer of silicon wafers needs to be done manually. The disadvantage is that manual handling can easily cause silicon wafers to break and increase production costs. At the same time, manual operations have low production efficiency and high labor intensity.

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