Double-wall efficient water-cooling base plate

Abstract

The invention discloses a double-wall efficient water-cooling base plate which comprises a grooved plate, a flat plate I fixed to the upper surface of the grooved plate, a flat plate II fixed to the lower surface of the grooved plate, a water inlet and a water outlet. The double-wall efficient water-cooling base plate is characterized in that the grooved plate comprises a left retainer plate, a right retainer plate, and a transverse plate, wherein the left retainer plate and the right retainer plate form an I-shaped grooved plate, and the transverse plate fixed between the left retainer plate and the right retainer plate divides the grooved plate into double cavities. A partition is further disposed between the left retainer plate and the right retainer plate and divides the transverse plate into an inlet cavity transverse plate and an outlet cavity transverse plate. The double cavities divided by the transverse plate are partitioned into four cavities allowing for flowing of coolant, namely an inlet cavity I, an inlet cavity II, an outlet cavity I and an outlet cavity II. Both the inlet cavity I and the inlet cavity II are provided with radiating fins inside. The double-wall efficient water-cooling base plate is capable of cooling on two sides, effectively decreases cooling interference between mounting surfaces of power modules on two sides and weakens the effect of high-temperature cooling water at the water outlet upon the power modules, so that the reliability of the power modules is improved and the service lives of the power modules are prolonged.

Description

technical field [0001] The invention relates to the technical field of heat exchange, in particular to a double-layer high-efficiency water-cooled substrate for cooling electronic components. Background technique [0002] With the rapid development of high power and high integration of electronic components, components with higher power density per unit volume are more and more widely used. In actual work, every time the temperature of power components increases by 10°C, their lifespan will be reduced by half. Therefore, the cooling devices matching high-power components are also gradually undergoing technological changes. The traditional air-cooled cooling method has been unable to meet the working requirements of high-power electronic components, and water-cooled is gradually replacing air-cooled and mainly used in the cooling of high-power components. Compared with the air-cooled plate, the water-cooled substrate has the characteristics of high heat dissipation efficienc...

AI Technical Summary

Problems solved by technology

The water outlet cavity partition plate structure is set under the board surface where the power module is installed, which will weaken the cooling effect of the coolant on the power module installed at the water outlet cavity, resulting in an increase in its operating temperature, reducing its reliability and service life.

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