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A method of manufacturing a printed circuit board and a printed circuit board structure

A technology for printed circuit boards and manufacturing methods, which is applied in the directions of printed circuit components, electrical connection formation of printed components, and electrical connection of printed components, etc., can solve problems such as impedance discontinuity, and achieve the effect of improving quality and maintaining integrity.

Inactive Publication Date: 2015-08-05
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problem of impedance discontinuity in the prior art, the present invention provides a method for manufacturing a printed circuit board and a printed circuit board structure

Method used

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  • A method of manufacturing a printed circuit board and a printed circuit board structure
  • A method of manufacturing a printed circuit board and a printed circuit board structure
  • A method of manufacturing a printed circuit board and a printed circuit board structure

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Embodiment Construction

[0036] The specific implementation manners of the present invention will be described in further detail below with reference to the accompanying drawings. However, this embodiment mode can be an application of various inventive concepts, and can be embodied in various specific ranges. The specific embodiments are for illustrative purposes only, and the embodiments do not limit the scope of the disclosure.

[0037] Generally, a through hole is composed of a ring-shaped pad on the outer layer and a hole wall perpendicular to the ring-shaped pad. When a pair of differential signals passes through the vias and is transferred from the upper layer to the lower layer, the width of the signal line will undergo multiple changes. For example, the line width of the transmission line is 5 mils. When the high-speed signal passes through the ring pad on the upper layer, the line width becomes 40 mils, and when passing through the hole wall, the line width becomes 24 mils. When the ring pa...

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PUM

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Abstract

The invention provides a method for manufacturing a printed circuit board and a printed circuit board structure. The method for manufacturing the printed circuit board comprises the steps of providing a circuit board, forming a through circuit board penetrated by a through hole, forming a through annular welding pad, which surrounds one end of the through hole, on one surface of the printed circuit board, printing a transmission line, which is connected to the through hole, through the annular welding pad on the surface of the circuit board, removing partial area of the annular welding pad to cause the difference between the minimal width of the annular welding pad and the width of the transmission line to be less than 20% of the width of the transmission line, and removing partial copper on the wall of the through hole to cause the difference between the minimal width of the through hole and the width of the transmission line to be less than 20% of the width of the transmission line. With the adoption of the method provided by the invention, the problem of discontinuous impedance can be solved.

Description

technical field [0001] The invention relates to a printed circuit board mechanism, in particular to a method for manufacturing a printed circuit board and a printed circuit board structure. Background technique [0002] Printed circuit boards with electronic components are printed circuit assemblies. In other words, the printed circuit includes a substrate and electronic components, wherein the electronic components are active components, passive components, transmission lines, and the like. Regarding the manufacturing method of the transmission line, the copper foil on the non-conductive substrate can be etched to form the transmission line. The transmission line can be used as a conductive path to electrically connect the active element and / or the passive element. Substrates can be used to carry electronic components. [0003] In the current high-end server system design, the bandwidth of high-speed signal data transmission has exceeded 10GT / s, and there is a high requi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40H05K1/11
Inventor 曹双林
Owner INVENTEC CORP
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