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A flexible circuit board bonding equipment and method for bonding flexible circuit boards

A technology for flexible circuit boards and bonding equipment, which is applied in the direction of assembling printed circuits with electrical components, can solve problems such as inconvenient operation, high cost, and reduced viscosity, and achieve simplified operation difficulty, high consistency in mass production, and high accuracy high effect

Active Publication Date: 2015-09-30
SHENZHEN VLG WIRELESS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing FPC antenna bonding is mainly done by hand. This method is inefficient and inconvenient to operate. Fingers are easy to come into contact with the FPC adhesive, resulting in a decrease in viscosity, easy warping, wrinkling, and low efficiency , The production is consistent and unstable, and the cost is high

Method used

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  • A flexible circuit board bonding equipment and method for bonding flexible circuit boards
  • A flexible circuit board bonding equipment and method for bonding flexible circuit boards
  • A flexible circuit board bonding equipment and method for bonding flexible circuit boards

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Embodiment Construction

[0023] In order to make the objectives, technical solutions and advantages of the present invention clearer and clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.

[0024] See figure 1 , figure 1 It is a schematic diagram of the structure of the flexible circuit board bonding equipment provided by the present invention. Wherein, the flexible circuit board laminating equipment includes a vertical support 10, a base 20, an air cylinder 11, an upper mold fixing seat 13, a slider 12, a lower mold fixing seat 21, and a power supply device 22.

[0025] Specifically, the vertical support 10 is fixed on the base 20, the slider 12 is mounted on the vertical support 10, and a sliding rail for the slider 12 to slide up and down is provided on the vertical s...

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Abstract

The invention discloses a flexible circuit board bonding device and a method for bonding a flexible circuit board. The flexible circuit board bonding device comprises a vertical support, a base, a sliding block capable of sliding vertically on the vertical support, an upper mould fixing seat installed on the sliding block, a cylinder installed on the vertical support and used for driving the sliding block to slide vertically, a lower mould fixing seat installed on the base and a module. The module comprises a lower mould for fixing the flexible circuit board and an upper mould for fixing a machine casing or the support, the upper mould is installed on the upper mould fixing seat, and the lower mould is installed on the lower mould fixing seat. The flexible circuit board bonding device replaces the traditional mode of manually bonding the flexible circuit board, and is high in production efficiency, high in product consistency, low in manufacture cost and strong in practicability.

Description

Technical field [0001] The invention relates to the field of built-in antennas for mobile devices, and in particular to a flexible circuit board bonding device and a method for bonding the flexible circuit board. Background technique [0002] With the advancement of science and technology, the rapid development of modern wireless communication technology, the appearance and volume of products are also constantly changing, antenna installation positions are becoming more and more complex, and flexible circuit antennas are increasingly used. Because the antenna performance is very sensitive to the environment, the antenna assembly position and the consistency of the assembly effect will affect the antenna performance consistency. The requirements for communication equipment continue to increase, and improving antenna performance and simplifying production processes are the ultimate goals of antenna optimization. [0003] The existing FPC antenna bonding is mainly manual. This method...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/30
Inventor 卓奇奕杨楚兵
Owner SHENZHEN VLG WIRELESS TECH
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