Multichip typesetting substrate and manufacturing method thereof

Abstract

The invention belongs to the technical field of printed circuit boards, and concretely relates to a multichip typesetting substrate. The multichip typesetting substrate comprises a frame (2) and multiple child substrates (3), the frame (2) and each child substrate (3) as well as the child substrates (3) are connected through multiple connecting mechanisms (8), and each connecting mechanism (8) comprises at least a mechanical limiting connection mechanism (4) which is used for limiting the child substrate (3) to move in two directions perpendicular to the surface of the frame (2). The invention also discloses a manufacturing method of the multichip typesetting substrate. The multichip typesetting substrate disclosed by the invention can reliably limit the child substrates to move in two directions perpendicular to the frame (2), therefore, the connecting strength between the child substrates, or between each child substrate and the frame, is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, in particular to a multi-piece typesetting substrate and a manufacturing method thereof. Background technique [0002] General printed circuit board construction such as figure 1 As shown, there are multiple sub-boards on the motherboard of a printed circuit board. After the circuit board is manufactured, each of the multiple sub-boards of the motherboard needs to be tested. When an unqualified sub-board is found , in order not to affect the yield of subsequent component packaging, the entire mother board including the remaining qualified sub-boards is usually discarded, which will not only lead to an increase in manufacturing costs, but also cause pollution to the environment. [0003] In view of the above problems, a technique of cutting out unqualified sub-boards in the motherboard and installing qualified sub-boards as a substitute has emerged. For example, Chinese patent CN1...

AI Technical Summary

Problems solved by technology

[0006] (2) Since the mutually combined peripheral buckle feet 509 and side plate connecting feet 506 are all stepped structures, and the precision of this stepped structure is difficult to control during the manufacturing process, if the thickness of the stepped parts of the two is thicker, it is easy to After the two are buckled together, the qualified printed circuit board piece 502' is higher than the finished printed circuit board 505, or the four sets of peripheral buckle feet 509 and side board connecting feet 506 used to connect the two have different thicknesses of the stepped parts. If they are not the same, the qualified printed circuit board sheet 502' cannot be installed parallel to the finished printed circuit board 505. In summary, since the thickness of the step part is not easy to guarantee, the uncertainty of the entire installation accuracy is increased, and it is easy to be installed on the printed circuit board. There are uneven steps on the finished board 505

[0007] (3) Due to the complex structure of the peripheral buckle foot 509, the buttonhole joint 510, the side plate connecting foot 506, and the tenon joint 507, when the peripheral buckle foot 509 and the side plate connecting foot 506 are small in size or the printed circuit board When the finished product 505 is a thin plate, the operable space is smaller, and there are certain difficulties in manufacturing

It can be seen from this that the single-piece part is only connected to the frame part through an adhesive. In such a structure, the connection strength, especially in the direction perpendicular to the single-piece part, is relatively low; in addition, the first opening part and the second opening part structure, when the size of the single-piece plate is small or when it is a thin plate, it is difficult to process because of the small operable space

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